1) optoelectronic integration
光电子集成
1.
Silicon based light emitting materials are the elemental materials for the future optoelectronic integration.
硅基发光材料是未来光电子集成的基础材料。
2.
The development of GaN material and its optoelectronic devices is one of the hot spots on optoelectronic research fields in recent years, and wafer bonding technology is an attractive fabrication method which has the potential for achieving desirable optoelectronic integration.
GaN材料及其有关光电子器件的研制是近年来光电子研究领域内的研究热点之一,而键合技术又是光电子集成研究领域内一项新的制作工艺。
3.
Silicon is a fundamental material for microelectronics, but Si-based light-emitting materials are necessary for developing optoelectronic integration.
为了发展光电子集成就必须研究硅基发光材料。
3) OEIC
光电子集成电路
1.
Recent advances in optoelectronic integrated circuits(OEICs) are described in detail with the emphasis on OEIC transmitters and receivers.
较详细地介绍了光电子集成电路 (OEIC)中研究最广泛、并取得可喜成就的OEIC光接收机和OEIC光发射机的最新进展 ,展望了OEIC的应用前景 ,并提出了目前应解决的课题。
4) Si-based OEIC
硅基光电子集成
5) integrated optoelectrical device
集成光电子组件
6) Si optoelectronic integration
Si基光电子集成
补充资料：光电对抗侦察(见光电对抗)
光电对抗侦察(见光电对抗)
electro-optical reconnaissance of electronic warfare
guangdian duikang zheneha光电对抗侦察(elee‘ro一op‘ical reconnais-sanee ofeleetronicwarfare)见光电对抗。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条