1) SOT-23 encapsulation
SOT-23封装工艺
2) SOT-23 capsulation
SOT-23封状工艺
3) SOT-23package
SOT-23封装
1.
SOT-23package is one of the most use packages of chip transistor.
在片式晶体管中,SOT-23封装是使用量最大的一种封装形式。
4) SOT-package
SOT封装
1.
Its small and skilful machanism is suitable for the mini type SOT-package components taped automatically at a high speed.
同时机械结构设计巧妙、体积小,适用于SOT封装型微小电子元器件的高速自动编带过程。
5) packaging process
封装工艺
1.
The influences of white light LED packaging process on its performance are discussed in this paper.
通过理论分析与实验数据说明了白光LED封装工艺对其性能的影响,特别针对模粒卡位、胶体外形等进行较为详细的分析。
2.
The thermal stress distribution of SCSP in packaging process was studied by finite element method.
利用有限元法研究了堆叠芯片封装(SCSP)器件在封装工艺过程中的热应力分布。
6) Packaging technique
封装工艺
1.
The titanium alloy slice packaging technique for fiber Bragg grating(FBG) sensor was developed in consideration of bare optical fiber being fragility,and the strain and temperature characteristics of the packaged FBG sensors were experimentally and theoretically studied.
提出了一种光纤光栅(FBG)的Ti合金片的封装工艺,实验和理论研究了FBG的应变和温度传感特性。
2.
Presented is the scheme of packaging technique of the FBG with a compact structure by using the red copper slice.
研究了光纤布拉格光栅的封装及其布设工艺,以及封装后的传感理论,提出并实现了一种光纤布拉格光栅的封装工艺,即用导热性能良好的紫铜片对光纤布拉格光栅进行封装,这种封装结构简单小巧。
3.
The steel capillary packaging technique for fiber Bragg grating(FBG)sensor was developed in consideration of bare optical fiber being fragility,and the strain and temperature characteristics of the packaged FBG sensors were experimentally and theoretically studied on material mechanics multifunctional experimental platform and in constant temperature box.
提出了一种光纤光栅的毛细钢管封装工艺,并通过材料力学多功能实验台和恒温箱对其应变与温度传感特性进行了研究。
补充资料：采气工艺(见天然气开采工艺)
采气工艺(见天然气开采工艺)
gas production technology
，一‘J\匕乙吕天然气开采工艺pro以uetionteehnology)见
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条