1.
Application of Plasma Cleaning in LED Package Process
等离子清洗在LED封装工艺中的应用
2.
Research on welding fault during LED chips packaging
LED芯片封装工艺中焊接缺陷研究
3.
Packing Technology of High Temperature Pressure Transducer
MEMS耐高温压力传感器封装工艺
4.
Research & Fabrication of Packaging Technology for High-Power White LED
大功率白光LED封装工艺技术与研制
5.
Optimization of SPC Control Limit Calculation Method of Assembly Process
封装工艺中SPC控制限计算方法的优化
6.
Study of the Process of the Flip Chip Package Based on Aluminum Nitride Substrate
以氮化铝陶瓷为基板的倒装式封装工艺研究
7.
Study of Practically Advanced Assembly and Packaging Process Manufacturing Technologies of MCM-C;
MCM-C实用先进组装封装工艺制造技术研究
8.
Research of Demodulation and Packaging Tecknics on Fiber Grating Sensors;
光纤光栅传感器解调技术及封装工艺的研究
9.
Improvement on the Packaging Process of 1X2 Single Mode FBT Fiber Splitters
1X2单模融拉型光纤分路器封装工艺的改进
10.
Application of Glass Sealed Technology in Aviation Thermocouple Production
玻璃封装工艺在航空热电偶生产中的应用
11.
Research and Development of Planar Waveguide Circuit's Packaging Software
平面波导器件封装工艺软件的研究与开发
12.
Influence of Fluorescent Glue Packaging Technology on the Color Rendering Index of High Power LED
大功率LED荧光胶封装工艺对其显色性能的影响
13.
Analysis of Welding Casing of Active Implantable Medical Devices
有源植入式医疗器械外壳封装工艺分析
14.
Study on FBG Sensor′s Steel Capillary Packaging Technique and Sensing Properties
光纤光栅毛细钢管封装工艺及其传感特性研究
15.
Study on Broad Band MMIC Package Design and Related Processes;
宽带MMIC的封装设计及相关工艺研究
16.
Technology of 3D Packaging and TSV
3D封装与硅通孔(TSV)工艺技术
17.
Gravel Asphalt Sealing Layer Technology Construction Technology and Construction Equipment Use
沥青碎石封层技术的施工工艺与施工装备运用
18.
PACKAGING OF WAVEGUIDE DEVICES BASED ON BULK SILICON MEMS TECHNOLOGY
基于体硅微机械工艺的光波导器件封装技术