1) Sn-Zn-Ag based solders
Sn-Zn-Ag
3) Pd-Ag-Sn-In-Zn alloy
Pd-Ag-Sn-In-Zn合金
1.
Age-hardening behaviour and the related microstructural changes were studied to elucidate the hardening mechanism of Pd-Ag-Sn-In-Zn alloy by means of hardness test,XRD,SEM.
通过硬度测试、X射线衍射(XRD)分析、扫描电镜(SEM)观察研究了Pd-Ag-Sn-In-Zn合金时效强化行为及相关的微观结构变化,从而很好地解释了该合金的时效强化机制。
4) Sn-Ag-Sb-Zn alloy
Sn-Ag-Sb-Zn焊料
1.
The Sn-Ag-Sb-Zn alloys containing trace P,Bi,In and Ga elements were investigated,and the mechanical properties and physical properties of these alloy was measured.
在Sn-Ag-Sb-Zn焊料合金中添加微量元素P、Bi、In和Ga,进行了力学性能和物理性能试验。
5) Sn-9Zn-Ag solder
Sn-Zn-Ag无铅钎料
6) Sn-Ag-Cu series
Sn-Ag-Cu系
1.
Measurement of mechanical properties of Sn-Ag-Cu series lead-free solder alloy by using micro-indentation;
微观压痕法测量Sn-Ag-Cu系无铅钎料的力学性能
补充资料：(-)-2,3-O-Isopropylidene-sn-glycerol
分子式：C6H12O3
分子量：132.16
CAS号：14347-78-5
性质：密度1.062。沸点72-73°C (8 mmHg)。折射率1.433-1.435。闪点80°C。比旋光度-13.7° (neat)。水溶性miscible。
分子量：132.16
CAS号：14347-78-5
性质：密度1.062。沸点72-73°C (8 mmHg)。折射率1.433-1.435。闪点80°C。比旋光度-13.7° (neat)。水溶性miscible。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条