1) F-tree
F树
1.
Method of Rule Meanings Generation Based on F-tree;
基于“F树”的规则含义生成方法
2) F 44 resin
F-44树脂
3) F-factor tree
F-因子树
4) F-44 epoxy resin
F-44环氧树脂
1.
The title photosensitive phenolic epoxy acrylate resin has been prepared based on acrylic acid and F-44 epoxy resin as basic materials,which contains epoxy as well as acrylic groups.
本文以丙烯酸和F-44环氧树脂为原料,合成了一种既含有环氧基又含有丙烯酸基的光敏酚醛环氧丙烯酸酯树脂。
5) epoxy resin F-51
F-51环氧树脂
6) bisphenol-F epoxy resin
双酚-F环氧树脂
1.
The kinetics of the cure reaction for a system of bisphenol-F epoxy resin with tetrabromophthalic anhydride as a curing agent, was studied by means of differential scanning calorimetry (DSC).
本文用示差扫描量热法(DSC)研究了双酚-F环氧树脂和固化剂四溴苯酐(PHT4)的固化反应动力学。
补充资料：(S)-10-羟基喜树碱
分子式：C20H16N2O5
分子量：364.35
CAS号：19685-09-7
性质：密度1.60。熔点265-270°C。
分子量：364.35
CAS号：19685-09-7
性质：密度1.60。熔点265-270°C。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条