1) through hole filling
通孔填孔
1.
The paper describes that achieves through hole filling by accelerator-free formulas in DC plating.
文章介绍了采用不含加速剂的直流电镀方案来实现通孔填孔技术,并提出通孔填孔的可能电化学机理。
2) via fill plating
导通孔填孔
3) via fill
通孔填充
4) via-filling
填孔
1.
Development status of via-filling technique was summarized,and the parameters applied to the via-filling,which includes the current density,the mode of agitation and waveform of current were also discussed.
综述了目前微孔填充技术的发展现状,对电镀过程中采用的电流密度、搅拌因素和电流波形等进行了探讨,重点讨论了添加剂对填孔效果的影响及其作用机理。
5) filled via and stacked via
堆积导通孔和填充导通孔
6) through-hole
通孔
1.
Effect of Different Additives on the uniform Deposition of through-hole by Pulse Electroplating in Acidic Copper Plating Bath;
添加剂对脉冲酸性镀铜通孔均匀沉积的影响
2.
Preparation of self-standing,through-hole anodic alumina membranes by cathodic polarization method in a neutral KCl solution;
中性水溶液中阴极电解制备自支撑通孔氧化铝膜
3.
Applying the software of ANSYS,based on the flat plat specimen,the finite element analysis about the wear resistance of bionic non-smooth through-hole specimen was given.
利用ANSYS软件,以平板试件为对比基准,对具有仿生非光滑通孔结构试件的耐磨机制进行了有限元分析。
补充资料：水性填孔料
水性填孔料 木家具油漆打底常用的一种填孔料，即“水老粉”。山碳酸钙（老粉）与水配比。用于粗木孔的为1：1；细木孔的为0.4：0.6，然后根据色泽要求加适量的着色颜料。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条