1) Au/Sn solder
金锡焊料
1.
In order to improve reliability of sintering,a new technique of sintering laser with Au/Sn solder was adopted.
为提高烧结可靠性,采用了金锡焊料烧结激光器新技术。
2) Lead-Tin solder
铅锡合金焊料
3) tin-lead solder
锡铅合金焊料
4) tinman's solder alloy
铅锡焊料合金
5) solder
[英]['səʊldə(r)] [美]['sɑdɚ]
焊料;焊锡
6) solder alloy
焊锡合金
1.
The fine powders of the solder alloy are one of the key materials in the SMT, the requirement as following: the particle diameter is in 5 u m~ 74 u m, the shape is spherical and the distribution of the particle size is uniform.
表面组装技术(SMT)已广泛应用于电子工业中，而焊锡合金微粉是该技术的关键材料之一，通常要求：粉末粒径5～74μm，形状为球形，且粒径分布均匀。
2.
The fine powders of the solder alloy are one of the key materials in the SMT, the shape is spherical, the distribution of the particle size is uniform, the low content of oxygen and predominant antioxidant.
表面组装技术(SMT)已广泛用于电子工业,而焊锡合金微粉是该技术的关键材料之一。
补充资料：金锡
【金锡】
（物名）锡杖也。
（物名）锡杖也。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条