1) Stacked-Die Low-Profile Fine-Pitch BGA
低外形细节距球栅阵列堆叠芯片
2) Ball grid array chip
球栅阵列芯片
3) Thin-profile fine-pitch ball grid array
细间距球栅阵列
1.
The stress arising from falling is apt to cause the solder joint failure or even complete machine trouble, especially to the printed circuit board which mounted with TFBGA (Thin-profile fine-pitch ball grid array).
便携式电子产品因其小体积、低重量而在使用或运输过程中易被跌落或滑落或受冲击,因跌落引起的应力容易导致焊点失效乃至整机故障,对贴装有细间距球栅阵列封装元器件(TFBGA:Thin-profile fine-pitch ball grid array)的印制电路板尤为如此。
4) Flip-Chip Ball Grid Array
球栅阵列倒装-芯片封装
5) fine-pitch ball grid array (FBGS)
微间距球栅阵列
6) stacked chip
芯片堆叠
1.
3D stacked chip package is one of the mainstream technologies in improving the storage capacity of memory card products.
芯片堆叠封装是提高存储卡类产品存储容量的主流技术之一,采用不同的芯片堆叠方案,可能会产生不同的堆叠效果。
补充资料：堆叠
一层一层地堆起来：案上～着大批新书。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条