1) Ball Grid Array(BGA)
球栅阵列(BGA)
2) BGA
球栅阵列
1.
Analysis on Stress and Strain Distribution of SnPb Solder Joint in BGA Package;
球栅阵列封装中SnPb焊点的应力应变分析
2.
Finite Element Analysis of Thermal Induced Damage in Ceramic BGA Devices Featuring Composite Solder Array;
复合球栅阵列CBGA封装器件热循环损伤的有限元模拟
3.
Thermal fatigue life of ceramic ball grid array(CBGA)devices under thermal cycling conditions was presented in-55℃～125℃.
研究了陶瓷球栅阵列(CBGA)器件在-55~125℃温度循环条件下的热疲劳寿命,采用光学显微镜研究了失效试件焊点的失效机制,分析了裂纹萌生和扩展的方式。
3) ball grid array
球栅阵列
1.
It can solve the problems such as inhomogeneous heating of different solder bumps in ball grid array,simultaneous heating of chip and carrier with solder ball,etc.
该方法能够很好地解决由于无铅钎料的应用引起的日益严重的诸多问题,如球栅阵列中各钎料球受热不均匀和芯片基板与钎料球同时受热等。
2.
The plastic ball grid array (PBGA) component test vehicles with different combinations of process parameters were designed based on full factorial experiment.
0mm引脚间距塑封球栅阵列(PBGA)器件测试样件,进行了500h的可靠性热循环试验;基于试验数据进行了极差分析和方差分析;用有限元方法分析了PBGA器件焊点内的应力分布。
3.
<Abstrcat>The orthogonal experiment design method was applied to study the relationships between solder joint process parameters and reliability of plastic ball grid array (PBGA) component.
基于正交试验设计法对塑封球栅阵列(PBGA)器件焊点工艺参数与可靠性关系进行了研究。
4) micro-ball grid array
微球栅阵列
5) plastic ball grid array
塑封球栅阵列
1.
Reliability test and analysis of 1.27mm pitch plastic ball grid array soldered joint under thermal shock;
热冲击条件下1.27mm引脚间距塑封球栅阵列器件焊点可靠性测试与分析
2.
A typical plastic ball grid array (PBGA) component was selected and the plastic ball grid array packaging was modeled as a tri-layer structure composed of encapsulation, die and substrate.
选取典型的塑封球栅阵列封装器件,将其建模为由封装外壳、硅芯片和基板组成的三层结构,采用粘塑性材料模式描述锡铅钎料的力学本构关系,建立器件的三维有限元模型,通过有限元仿真得到焊点的应力应变分布云图、应力应变回线及关键焊点的应变范围,最后根据基于应变的Engelmaier疲劳模型预测塑封球栅阵列焊点的寿命。
6) CBGA
陶瓷球栅阵列
1.
Construction of a Three-dimensional FEA Model of CBGA and Simulation of the Three-dimensional Stress and Strain of Weld;
陶瓷球栅阵列封装的有限元模拟与焊点应力分析
2.
The components of CBGA was simplified into 2-D model of finite element analysis for the stress and strain of soldered joint,and the finite element method was used to simulate the distribution of stress and strain of three kinds of CBGA components(0.
3 mm)组件,利用有限元模拟CBGA(陶瓷球栅阵列)组件在热循环加载条件下其应力应变分布,并且计算了焊点的应力应变最大值,得出球径为0。
补充资料：Acid Blue BGA
分子式：
CAS号：
性质：深蓝粉末。溶于水呈蓝色。在浓硫酸中呈红紫色。染色牢度：日晒4～5，皂洗3～4。色光鲜艳。匀染性好。由酸性蓝2R和酸性绿BS拼混而成。主要用于毛线染色。匀染性好，与酸性淡黄2G、酸性红BG组成三原色。也用于染其他各种羊毛织品。
CAS号：
性质：深蓝粉末。溶于水呈蓝色。在浓硫酸中呈红紫色。染色牢度：日晒4～5，皂洗3～4。色光鲜艳。匀染性好。由酸性蓝2R和酸性绿BS拼混而成。主要用于毛线染色。匀染性好，与酸性淡黄2G、酸性红BG组成三原色。也用于染其他各种羊毛织品。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条