1) large area Au bump
大面积金凸点
1.
The test results showed that the shear force of the large area Au bumps connection was 53.
测试结果表明获得的大面积金凸点连接的剪切力最高达53。
2) dot illuminant with big areas
大面积点光源
3) diamond films with large area
大面积金刚石膜
1.
Smooth and uniform diamond films with large area are essential for their applications in electronics due to excellent properties of diamond.
平整均匀的大面积金刚石膜是其在电子领域工业化应用的前提。
4) gold bump
金凸点
1.
Fine pitch ECD gold bumping towards future demands;
面向未来需求的细间距电化学沉积金凸点工艺(英文)
2.
Research of gold bump for wafer level package;
用于圆片级封装的金凸点研制
3.
Gold bump bonding process is used for raising bond wire.
金凸点键合工艺用于提高国产陶瓷外壳键合指 上的键合引线强度有非常明显的效果,是一项较新的技术。
5) gold stud bump
金球凸点
1.
The process of gold stud bumps was introduced.
对金球凸点制作进行了介绍。
6) metal bump
金属凸点
1.
The preparation of metal bump and wire substrate have been researched,as well as flip-chip bonding technology.
对金属凸点、引线衬底的制备以及倒装焊接技术进行了研究。
补充资料：凸凸
1.高出貌。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条