1) wafer bonding and mechanical thinning
键合减薄
1.
Ultrathin LiTaO_3 wafer prepared by wafer bonding and mechanical thinning processes;
超薄LiTaO_3晶片的键合减薄技术
2) bonded TLC plates
键合相薄层板
1.
cyclodstrin(β-CD) bonded TLC plates were prepared with different binders.
采用不同粘合剂制备了β环糊精（β－ＣＤ）键合相薄层板，认为用有机粘合剂所制作的板牢固、重现性好。
3) development of polymer film riblets
减阻聚合物薄膜
4) thinning
[英][θin] [美][θɪn]
减薄
1.
After raising the temperature of return stream to the tower, no thinning of pipeline wall had been found in 2006 inspection.
文章针对催化裂化分馏塔塔顶循环回流线短时间减薄的特殊情况,进行了腐蚀原因分析。
2.
Several methods for plastically thinning the thin_wall pipes were introduced.
介绍了薄壁圆管塑性减薄的几种方法 ,通过比较 ,决定采用拉管工艺 ,并介绍了拉管减薄模具的结构及使用模具对铝合金管进行减薄的试验结果。
3.
This article analyzes the thinning reason of pressure vessel shell after processed, the process procedure and process error's affection on shell's thinning, and presents specific measure to control the shell's thinning amount and compensate the thinning.
本文分析了压力容器壳体加工减薄的原因,以及加工工艺、加工误差对壳体减薄的影响,提出了控制壳体厚度减薄量及减薄补偿的具体措施。
6) membrane keyboard
薄膜键盘
补充资料：减薄
1.亦作"减薄"。 2.降低;减弱。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条