1) complete thickness decrease
全面减薄
2) back thinning
背面减薄
1.
As IC chips are fast developing toward higher density, higher performance and smallersize, to meet the demands of IC package, back thinning of the patterned wafer is one of most impor-tant procedure in the backend of semiconductor manufacturing process.
集成电路芯片不断向高密度、高性能和轻薄短小方向发展,为满足IC封装要求,图形硅片的背面减薄成为半导体后半制程中的重要工序。
3) across-the-board tax-cut
全面减税
4) across-the-board cut
全面削减
6) thinning
[英][θin] [美][θɪn]
减薄
1.
After raising the temperature of return stream to the tower, no thinning of pipeline wall had been found in 2006 inspection.
文章针对催化裂化分馏塔塔顶循环回流线短时间减薄的特殊情况,进行了腐蚀原因分析。
2.
Several methods for plastically thinning the thin_wall pipes were introduced.
介绍了薄壁圆管塑性减薄的几种方法 ,通过比较 ,决定采用拉管工艺 ,并介绍了拉管减薄模具的结构及使用模具对铝合金管进行减薄的试验结果。
3.
This article analyzes the thinning reason of pressure vessel shell after processed, the process procedure and process error's affection on shell's thinning, and presents specific measure to control the shell's thinning amount and compensate the thinning.
本文分析了压力容器壳体加工减薄的原因,以及加工工艺、加工误差对壳体减薄的影响,提出了控制壳体厚度减薄量及减薄补偿的具体措施。
补充资料：减薄
1.亦作"减薄"。 2.降低;减弱。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条