1) HDI & IC substrates
HDI和IC基板
2) IC packaging substrate
IC封装基板
4) hexamethylene diisocyanate
HDI
1.
HDI/St, HDI/AN and HDI/MMA interpenetrating polymer networks (CO-PU IPN ) were synthesized by using castor oil (CO), hexamethylene diisocyanate (HDI) and the monomercrosslinking agent styrene (St), Acrylonitrile (AN), methyl methacrylate (MMA) as materials.
用蓖麻油(CO)、六亚甲基二异氰酸酯(HDI)和单体交联剂苯乙烯(St)、丙烯腈(AN)、甲基丙烯酸甲酯(MMA)为主要原料,制得了HDI/St、HDI/AN和HDI/MMA等3种蓖麻油/聚氨酯互穿网络型聚合物(CO-PU IPN);研究了CO-PU IPN组成对拉伸性能的影响,并利用红外光谱分析对IPN的潮气固化过程进行了分析。
5) dissymmetry HDI manufacturing example
HDI板制作实例
6) IC-Substrate
IC载板
补充资料：biuret of hdi
CAS：4035-89-6
分子式：C23H38N6O5
中文名称：N,N'-2-三(6-异氰酸根合己基)亚氨二碳酸二酰胺；己二异氰酸酯缩二脲；三(异氰酸根合己基)缩二脲
英文名称：N,N'-2-tris(6-isocyanatohexyl)-Imidodicarbonic diamide；Hexamethylene diisocyanate biuret；isocyanic acid, triester with 1,3,5-tris(6-hydroxyhexyl)biuret；1,3,5-tris-(6-isocyanatohexyl) biuret；biuret of hdi；biuret of hmdi
分子式：C23H38N6O5
中文名称：N,N'-2-三(6-异氰酸根合己基)亚氨二碳酸二酰胺；己二异氰酸酯缩二脲；三(异氰酸根合己基)缩二脲
英文名称：N,N'-2-tris(6-isocyanatohexyl)-Imidodicarbonic diamide；Hexamethylene diisocyanate biuret；isocyanic acid, triester with 1,3,5-tris(6-hydroxyhexyl)biuret；1,3,5-tris-(6-isocyanatohexyl) biuret；biuret of hdi；biuret of hmdi
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条