1) patterned porous silicon
图案化多孔硅
1.
Preparation and characterization of thick patterned porous silicon layers;
图案化多孔硅是微电子、微机械、光电子器件的重要组成部分。
2) porous SiC
多孔碳化硅
1.
Sample of porous SiC polycrystals are prepared by solid sintering process under high temperature and normal pressure using moulding SiC powder.
碳化硅粉末经压制成型后,在高温常压下固相烧结制成多孔碳化硅样品。
3) OPS
[ɔps]
氧化多孔硅
1.
Uniform Ag nano-particles was synthesized within nanoscale pores of oxidized porous silicon (OPS) by a simple solution immersion-thermal decomposition approach,forming the compound structure of Ag/OPS/silicon.
通过简单的溶液浸泡-热分解方法成功地在氧化多孔硅的孔中沉积了纳米银粒子,形成了银／氧化多孔硅／硅的复合结构。
2.
A copper inductor based on oxidized porous silicon(OPS)insulating technology is presented.
提出了一种基于氧化多孔硅厚膜隔离技术的Cu电感。
4) porous silica
多孔氧化硅
1.
Preparation of porous silica with nanofibrous morphology from chrysotile;
采用纤蛇纹石制备纳米纤维状多孔氧化硅
2.
The phase-separation theory was used to prepare the porous silica from silicic gel derived from fly ash.
利用相分离原理,以粉煤灰经硅铝分离后所得的硅酸凝胶为原料,选用聚乙烯醇为造孔剂,硝酸为催化剂,成功地制备了多孔氧化硅。
3.
The influence of CTAB concentration on the structure and properties of mesoporous silica films is studied as well.
报道了一种新型纳米多孔氧化硅薄膜的制备方法 ,并详细探讨了表面活性剂浓度对介孔氧化硅薄膜结构和性能的影响。
5) Oxidized porous silicon
氧化多孔硅
1.
Fabrication of free standing structure using oxidized porous silicon as sacrificial layers;
用氧化多孔硅作牺牲层制备悬空微结构
2.
The realization of oxidized porous silicon waveguides lens by selectively electrochemical anodisation process is presented.
给出了利用选择性的电化学腐蚀过程制备氧化多孔硅光波导棱镜的方法,分别制备出基于多孔硅的汇聚和发散透镜。
3.
The technique is based on the use of oxidized porous silicon as sacrificial layer for the air gap and the heavy p+-doping silicon of approximately 15μm thickness for the stiff backplate.
用氧化多孔硅作牺牲层制备空气隙 ,用约 15μm厚的浓硼掺杂硅作为微传声器的刚性背极板 。
6) porous oxidized silicon
多孔氧化硅
1.
Preparation and photoluminescence of nano-porous oxidized silicon;
纳米多孔氧化硅的制备及荧光光谱研究
2.
Thus the porous oxidized silicon was selected as the optimal solid phase matrix for the purification DNA.
在硅基片上制备4种固相载体,分析不同载体的性质和制备特点,优选多孔氧化硅作为萃取DNA的固相载体。
补充资料：氨基多孔硅珠
分子式：
CAS号：
性质：一种二氧化硅胶，白色微珠形颗粒。以多孔硅珠为基料，与（3-氨基丙基）-三乙氧基硅烷反应制取。键合基团为—(CH2)3—NH2。比表面积400～450㎡/g。颗粒320～400目。为高速液相色谱填料，用于分配色谱。
CAS号：
性质：一种二氧化硅胶，白色微珠形颗粒。以多孔硅珠为基料，与（3-氨基丙基）-三乙氧基硅烷反应制取。键合基团为—(CH2)3—NH2。比表面积400～450㎡/g。颗粒320～400目。为高速液相色谱填料，用于分配色谱。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条