1) multi-layer AHB bus
多层AHB总线
1.
In order to slove the problem of OCS AHB limited bus bandwidth,this paper tells of an interconnect martix architectural multi-layer AHB bus based on AHB bus,and describes the design and implementation of the bus according to the designs of various submodules and intercommunication between among them.
为了解决AHB片上总线有限带宽的问题,文中在其基础上,介绍了一种交叉互连矩阵结构的多层AHB总线,并从各子模块设计、以及各子模块之间的相互通信描述了多层AHB总线设计及其实现。
2) AHB bus
AHB总线
1.
Research of transaction level AHB bus model
事务级AHB总线模型研究
2.
This paper introduces the design and implementation of an AHB bus bridge of crossing clock domains.
介绍一种跨时钟域的32位AHB总线桥的设计与实现。
3.
As the basic SoC design technique,the AHB bus interface design consists of master module interface design and slave module interface design.
AMBA总线结构广泛应用于片上系统设计中,其中AHB总线用于系统中高性能、高时钟速率模块间通信。
3) AHB
AHB总线
1.
Design of an AHB Bus Arbitrator Device;
AHB总线仲裁器的设计
2.
The characteristics of design for embedded CPU based on IP core are analyzed ,then provides the hole problems existing in design of AHB (advanced high-performance bus) interface in a ARM core based CPU .
结合体系的设计,给出了通过改进AHB总线解决这些空洞的方法。
4) AHB/APB bus
AHB/APB总线
5) Double-AHB bus
双AHB总线
6) AMBA-AHB
AMBA-AHB总线
1.
Implementation of JPEG decoding based on AMBA-AHB multi-processor architecture
基于AMBA-AHB总线多核平台的JPEG解码
补充资料:多层沉积层
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性质:由两种或两种以上相继沉积的金属构成的沉积层。这些沉积层可以由不同特性的同一金属或不同金属构成。如为了提高镍镀层的防护性,有时采用双层镍或三层镍镀层。又如为防护-装饰目的采用的铜/镍/铬三层镀层。
CAS号:
性质:由两种或两种以上相继沉积的金属构成的沉积层。这些沉积层可以由不同特性的同一金属或不同金属构成。如为了提高镍镀层的防护性,有时采用双层镍或三层镍镀层。又如为防护-装饰目的采用的铜/镍/铬三层镀层。
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
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