1) back-end
![点击朗读](/dictall/images/read.gif)
后端
1.
This paper proposes a new methodology to design highly-balanced and highly-reliable front-end controllable clock tree,and solves the problem that clock tree has to be designed iteratively until performance and power dissipation requirements are met in back-end flow.
提出一种新的高平衡、高可靠性的前端可控时钟树设计方法,解决时钟树需要在后端工具中多次反复以达到满足性能和功耗要求的问题。
2.
The equivalent checking in the formal verification was through the whole of digital circuit back-end design, such as: the comparison between RTL and netlist; the one between netlist and layout.
其中形式验证中的等价性检查贯穿于整个后端设计流程之中。
2) back end
![点击朗读](/dictall/images/read.gif)
后端
1.
Taking the back end design of bluetooth baseband chip for example, the article introduces the semi custom ASIC design flow and design principles by using the auto place & route tool .
从ASIC设计的原理、流程入手 ,以蓝牙基带芯片的后端设计为例 ,介绍用自动布局布线工具实现半定制专用集成电路 (ASIC)设计。
3) rear end
![点击朗读](/dictall/images/read.gif)
后端,末端
4) afterend
![点击朗读](/dictall/images/read.gif)
船尾端后端
5) backend porting
![点击朗读](/dictall/images/read.gif)
后端移植
1.
Analysis of LLVM Compiler Infrastructure and Backend Porting for Arm;
![点击朗读](/dictall/images/read.gif)
LLVM编译系统结构分析与后端移植
6) back-end design
![点击朗读](/dictall/images/read.gif)
后端设计
1.
As the scale of integrated circuit enlarges and the speed increases, the back-end design in Deep Submicron (DSM) Technology has experienced a rapid development.
本文通过对传统大规模集成电路设计流程的优化,得到了更适合于深亚微米工艺集成电路的后端设计流程,详细介绍了包括初步综合、自定义负载线的生成、版图规划、时钟树综合、静态时序分析等,并通过前端和后端设计的相互协作对大规模集成电路进行反复优化以实现设计更优。
补充资料:1,3-甲苯二异氰酸酯与羟基封端聚丁二烯和2-羟乙基丙烯酸甲酯的聚合物
CAS:68987-46-2
分子式:(C9H6N2O2·C6H10O3·C4H6)x
中文名称:1,3-甲苯二异氰酸酯与羟基封端聚丁二烯和2-羟乙基丙烯酸甲酯的聚合物
英文名称:Benzene, 1,3-diisocyanatomethyl-, polymer with hydroxy-terminated polybutadiene, 2-hydroxyethyl methacrylate-blocked
分子式:(C9H6N2O2·C6H10O3·C4H6)x
中文名称:1,3-甲苯二异氰酸酯与羟基封端聚丁二烯和2-羟乙基丙烯酸甲酯的聚合物
英文名称:Benzene, 1,3-diisocyanatomethyl-, polymer with hydroxy-terminated polybutadiene, 2-hydroxyethyl methacrylate-blocked
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
参考词条