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1)  blind-hollow brick
盲孔砖
1.
The article introduces the forming principle, design project, main technical performs, present application status, and the assume of further research and development of blind-hollow brick machine.
本文介绍盲孔砖成型机的压制原理、设计方案、主要技术性能、应用现状,以及进一步开发和研究的设想。
2)  back covered porous brick
盲孔多孔砖
1.
But it is possible to reduce the shear resistance and aseismatic ability when back covered porous brick builds the brickwork because it has not the "pin" formed by the masonry mortar leaked.
盲孔多孔砖是20世纪90年代后期研制成功的、用半干压法压制成型的封底多孔砖,它生产效率高,节约能耗,产品致密,外形好,强度高,易砌筑,用于砌体工程时,可节约1/3砂浆。
3)  autoclaved flyash-lime bricks with blind hole
蒸压粉煤灰盲孔砖
1.
In order to test the shear properties of autoclaved flyash-lime bricks with blind hole with the Masonry Structure Design Code,the experimental study on the masonry which was built by the brick with blind hole by 4 different grades of mortar was done,a large number of data were obtained.
为了检验蒸压粉煤灰盲孔砖的抗剪性能是否符合砌体结构设计规范,通过对4组具有不同砂浆强度等级的蒸压粉煤灰盲孔砖砌体进行抗剪性能的试验研究,大量试验数据证明了由这种新型块体材料砌筑的砌体抗剪强度符合规范计算值,为完善该类砖的建筑技术规程提供了科学依据。
4)  blind hole
盲孔
1.
Applied formula of nickel eletroplating additive for deep and blind hole;
深孔盲孔镀镍添加剂应用配方探讨
2.
Discussion on estimating the blind hole during chemical grouting;
化灌中对盲孔判定问题的探讨
3.
Building blind hole structure analyzer of the oil perforating gun based on BP neural network;
基于BP神经网络建立石油射孔枪盲孔结构分析器
5)  Micro-pore
盲孔
1.
An opto-electronic inspection system based on the direct imagery theory is presented for non-contact observation of the micro-profile of a small area, especially that of the underside of a micro-pore.
针对微小面积,特别是微小"盲孔"底面形貌的非接触精密检测,提出了一种基于直接成像原理的光学结构。
6)  blind via
盲孔
1.
The investigation on the cracking morphology of the blind vias and chemical analysis on the grain boundary of copper - plating layers have definitely identified that inappropriate compositions of electroplating solution and sulfur segregation are the critical causes of the crack defect.
通过观察盲孔的开裂形貌、分析裂纹的化学成分,确认了镀液配比不当、硫等杂质元素偏析是引起开裂缺陷的关键起因,并首次提出了开裂的失效机制。
2.
Failure of blind via is one of the main causes of an open circuit in printed circuit board(PCB).
盲孔开裂是导致印制电路板(PCB)电气断路的主要原因之一。
补充资料:盲盲
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