15mm high aspect micro blind vias of common plating equipment.

Applied formula of nickel eletroplating additive for deep and blind hole;

Discussion on estimating the blind hole during chemical grouting;

Building blind hole structure analyzer of the oil perforating gun based on BP neural network;

An opto-electronic inspection system based on the direct imagery theory is presented for non-contact observation of the micro-profile of a small area, especially that of the underside of a micro-pore.

The investigation on the cracking morphology of the blind vias and chemical analysis on the grain boundary of copper - plating layers have definitely identified that inappropriate compositions of electroplating solution and sulfur segregation are the critical causes of the crack defect.

Failure of blind via is one of the main causes of an open circuit in printed circuit board(PCB).

But it is possible to reduce the shear resistance and aseismatic ability when back covered porous brick builds the brickwork because it has not the "pin" formed by the masonry mortar leaked.