1) packaging of MEMS
体硅键合技术
2) Si/Si low temperature direct bonding technology
硅/硅低温键合技术
3) bonding technology
键合技术
1.
Integrated optical interferometer based on bonding technology;
基于键合技术的新型集成光学干涉仪
2.
In this system,the loading structure,frictional pair and force sensors are all integrated on a single chip by the bulk silicon process and bonding technology.
为比较真实地模拟可动微机电器件侧面间的摩擦磨损状况,进而研究MEMS器件的摩擦磨损规律,设计和研制了一种基于单晶硅材料的微摩擦试验模块,利用微机械体硅工艺及键合技术,将摩擦磨损测试单元、加载单元以及微力传感元件集成在单一的芯片上。
4) Bulk silicon technology
体硅技术
6) Silicon/silicon bonding
硅/硅键合
1.
The research of resonance pressure sensor technology has been done by used silicon/silicon bonding, grinding and IC process, the compatible technology problems of three- dimension bulk manufacturing and planar IC process have been resolved.
文章利用硅/硅键合、减薄抛光和IC工艺技术,开展硅基谐振型压力传感器技术研究,解决了三维体加工与IC工艺兼容的关键技术问题,成功地研制出一种硅基谐振型压力传感器样品,在常压下测试其Q值达到400,进一步参数测试还在进行中。
补充资料：氮化硅纤维增强体(见氮化硅纤维)
氮化硅纤维增强体(见氮化硅纤维)
silicon nitride fibres reinforcements
夔薰黔慧燃泳
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条