1) power LED
功率LED
1.
In this paper, the origins and the development of the GaN solid state light source are reviewed and prospected, and some sorts of chips for visible light power LED.
本文对GaN固体光源的起源和发展做了回顾和展望,并给出几种可见光功率LED芯片的结构及其封装特点,最后指出在未来50年内,用GaN固体光源取代白炽灯照明将成为现实。
2.
The measurement method of thermal resistor for power LED based on electrical parameters measurment is analyzed.
分析了功率发光二极管(LED)基于电学测量的热阻的测量方法,介绍了采用高性能数据采集卡构建了新型的功率LED热特性自动测量分析系统,实现对功率LED结温和热阻的精确、简便的测量。
2) high power LED
高功率LED
1.
A novel measuring method of thermal resistance for high power LED;
一种高功率LED热阻的测试方法
2.
The drivers of high power LED used series are studed.
着重研究了任意个(1-20个)高功率LED串联联接的恒流源驱动器。
3.
Preliminary experimental tests on a close-looped micro jet cooling system for high power LEDs were conducted.
对一种高功率LED散热用封闭微喷射流系统开展了初步的实验测试,测试结果和简单的数学分析表明实验用微喷系统有较大的改进空间。
3) power LED
功率型LED
1.
Impact of the chip bonding layer material on the thermal resistance of power LED
芯片键合层材料对功率型LED热阻的影响
2.
The paper introduces the key technology in three periods of power LED industry chain of our country.
本文介绍了我国功率型LED产业链三个阶段的关键技术。
3.
In the aspect of thermal dispersion for power LEDs,flip-chip configuration has potential predominance.
与正装LED相比,倒装焊芯片技术在功率型LED的散热方面具有潜在的优势。
4) high-power LEDs
大功率LED
1.
With the invention of high-power LEDs,the requirement for drive current has increased significantly,thereby increasing power dissipation.
保持LED结温在允许的范围内,是大功率LED芯片制备、器件封装和器件应用等每个环节都必须重点研究的关键因素,尤其是LED器件封装和器件应用设计必须着重解决的核心问题。
2.
The junction temperature of high-power LEDs is accurately measured based on forward-voltage method,the precision with ±0.
介绍了基于正向电压法原理自行研制的大功率LED结温测试系统,结温定量测量精度可达±0。
3.
Meanwhile, one type of thermal resistance model of high-power LEDs has also been set up.
针对大功率LED应用,建立了大功率LED的热阻模型,分析了环境温度、器件的最大允许结温、热阻以及输入电流之间的关系,提出了一种保证器件结温低于容许最大结温的工作电流的确定方法,并给出了一个应用本方法绘制某大功率LED工作电流与环境温度的关系曲线的实例。
5) high-power LED
大功率LED
1.
Simulation and design of high-power LED s package structure;
大功率LED封装结构的仿真设计
2.
Testing system for thermal resistance of high-power LED;
大功率LED热阻测试系统的开发
3.
Novel packaging materials and thermal management of high-power LED packaging;
新型封装材料与大功率LED封装热管理
6) high power LED
大功率LED
1.
Research on Control Techniques of High Power LED;
大功率LED驱动控制研究
2.
The design and realization of high power LED control project based on 4242G
基于4242G的大功率LED控制方案的设计与实现
3.
Measurement and analysis on thermal characteristics of high power LED based on heat pipe
基于热管散热的大功率LED热特性测量与分析
补充资料：70t超高功率电弧炉(淮阴钢铁公司)
70t超高功率电弧炉(淮阴钢铁公司)
彝 70t超高功率电弧炉(淮阴钢铁公司)
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条