The thesis main point is an definite introduction of some abnormalities during the process of encapsulation for low power LEDs,and for the abnormalities,the paper also includes academic analysis and solutions,simultaneously,they will be great and valuable reference on low power development and encapsulation.

A novel measuring method of thermal resistance for high power LED;

The drivers of high power LED used series are studed.

Preliminary experimental tests on a close-looped micro jet cooling system for high power LEDs were conducted.

Impact of the chip bonding layer material on the thermal resistance of power LED

The paper introduces the key technology in three periods of power LED industry chain of our country.

In the aspect of thermal dispersion for power LEDs,flip-chip configuration has potential predominance.

With the invention of high-power LEDs,the requirement for drive current has increased significantly,thereby increasing power dissipation.

The junction temperature of high-power LEDs is accurately measured based on forward-voltage method,the precision with ±0.

Meanwhile, one type of thermal resistance model of high-power LEDs has also been set up.

In this paper, the origins and the development of the GaN solid state light source are reviewed and prospected, and some sorts of chips for visible light power LED.

The measurement method of thermal resistor for power LED based on electrical parameters measurment is analyzed.

Simulation and design of high-power LED s package structure;

Testing system for thermal resistance of high-power LED;

Novel packaging materials and thermal management of high-power LED packaging;