1) interface coupling strength
界面耦合强度
2) interface coupling
界面耦合
1.
Dependence of the spin polarization on the strength of the electron phonon coupling in a polymer and the spin dependent effect of the interface coupling were discussed.
同时还研究了有机分子链内自旋极化随电子 声子耦合强度的变化关系以及界面耦合的自旋相关效
2.
On the other hand, the experimental results show that an antiferromagnetic interface coupling is necessary to induce positive exchange bias.
本文采用铁磁畴壁模型,研究了双层膜系统中不同界面耦合性质下冷却场以及其铁磁层厚度对交换偏置场的影响,通过对这一现象的研究,希望能更深入的理解交换偏置场产生机制,并为其在实践上的应用提供理论指导。
3) interfacial coupling
界面耦合
1.
It was found that the electronic density in the lowest conductive state(LUMO) could be tuned by the ratios of homopolymers and interfacial coupling.
本文针对聚乙炔 (polyacetylene) (PA)和聚对苯撑 (poly(p phenylene) ) (PPP)组成的三嵌段 (tri block)共聚物xPA/nPPP/yPA的量子阱性质进行了研究 ,发现均聚物组份及其界面耦合对共聚物的电子态具有调制作用。
2.
It is found that varying the scales, ratios and the intensity of interfacial couplings of the components, may modulate the structures of energy levels of copolymers.
研究发现可以通过改变均聚物的尺度、配比或界面耦合强度对共聚物能带结构加以调制 。
5) interface bonding strength
界面结合强度
1.
Finite element simulation of a test model for interface bonding strength between coating and substrate;
涂层与基体界面结合强度测定模型的有限元模拟
2.
The influence of interface bonding strength and plastic-elastic mismatch on the fatigue crack propagation behavior was considered.
采用四点弯曲试样在高频疲劳试验机上对铝基复合层板进行了疲劳试验,采用直流电势法测量裂纹长度,用扫描电镜和光学显微镜观察其疲劳断口及疲劳裂纹形貌,通过对比性试验,考察了组元性能错配和界面结合强度对复合板L-T取向疲劳裂纹扩展行为的影响,并用断裂力学理论对其进行了初步分析。
3.
C/Cu composites with different interface bonding strength have been fabricated by adding Sn,Ni or Fe element to the copper matrix.
本文通过在Ｃ／Ｃｕ复合材料的Ｃｕ基体中添加不同的合金元素（Ｓｎ，Ｎｉ，Ｆｅ）获得不同的界面结合强度，研究了界面结合强度对Ｃ／Ｃｕ复合材料热膨胀特性的影响规律，并分析了界面结合强度对降温过程中复合材料的收缩特性及残余应变的影响。
6) interfacial bonding strength
界面结合强度
1.
Study on the detection of interfacial bonding strength of coatings(Ⅱ):detecting system of bonding strength;
涂层界面结合强度检测研究(Ⅱ):涂层结合界面应力检测系统
2.
The interfacial bonding strength is a crucial factor in determining ultimate mechanical properties and performances of coatings and thin films, and the life of a specimen or workpiece, apart from the external factors, such as loading conditions.
界面结合强度是涂层／基体材料体系中的一项重要力学性能指标。
3.
At the same time,residual stresses of Ni-P alloy film coated on silicon substrate by laser heat treatment were measured,and effects of residual stress of the film on wear property and interfacial bonding strength were analyzed.
用扫描电镜(SEM)观察了化学沉积Ni-P合金薄膜/单晶硅基体的结构与颗粒度,利用X射线衍射(XRD)技术测试了其化学沉积后的残余应力,测量了激光热处理后残余应力的变化规律,分析了残余应力对磨损性能及界面结合强度的影响。
补充资料：表光合强度(见光合强度)
表光合强度(见光合强度)
forecast of sowing or transplanting time
b iaoguanghe qiangdu表光合强度见光合强度
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条