1) silicone resin composites
硅树脂基复合材料
1.
Effect of temperature on dielectric and mechanical properties of methyl silicone resin composites;
温度对甲基硅树脂基复合材料介电性能及力学性能的影响
2) methylsilicone resin composites
甲基硅树脂复合材料
1.
The dielectirc properties of methylsilicone resin composites as a function of decarbonizer MO (a kind of metal oxide) were investigated, and the mechanism was discussed.
研究了除碳剂MO对甲基硅树脂复合材料介电性能的影响及其作用机理。
3) Resin matrix composite
树脂基复合材料
1.
The article described mechanism of physical and chemical modification technology of resin matrix composite and its progress.
概述了树脂基复合材料物理及化学改性技术的作用机理,以及近年来改性技术的最新进展情况,对几种典型改性树脂基复合材料做了简要的介绍。
2.
The theory and application of the resin matrix composite in infrared stealthy technique,radar stealthy technique,and multiple spectrum stealthy technique are presented.
阐述了树脂基复合材料在红外隐身,雷达隐身、多谱隐身技术中的隐身原理及应用情况,分析了树脂基复合材料在隐身技术中的地位和广阔应用前景。
3.
The basic conception of the photopolymerization reaction, the constitution of the photopolymerization resin matrix and the kinds of the reinforced materials in the photopolymerization resin matrix composites were introduced.
介绍光固化反应的基本概念、光固化树脂基体的组成及光固化树脂基复合材料用增强材料的种类。
4) resin based composite
树脂基复合材料
1.
The requirements for the interfacial combining of the resin based composite under forced condition have been analyzed.
分析了树脂基复合材料受力状况下对界面结合的要求 ,着重介绍了微量冲击和临界纤维断裂长度分析两种检测树脂基复合材料界面剪切强度的方法及其研究成果。
2.
Several resin based composites were prepared by filling of graphite, carbon black and coke in phenolic resin, NBR modified phenolic resin and polytetrafluroethylene (PTFE) as the bonding agents.
采用酚醛树脂、丁腈橡胶改性酚醛树脂和聚四氟乙烯 (PTFE)作为粘结相 ,通过填充一定配比的石墨、焦炭及碳黑制备了 3种树脂基复合材料电刷试样 ,并在 MM- 2 0 0型摩擦磨损试验机上对比考察了复合材料试样与铜对摩时的摩擦磨损性能 。
3.
The types of resin based absorbing composites were presented,such as carbon/thermoplastic resin based composite,fiber reinforced resin composites,resin based nanocomposite.
本文介绍了目前应用在吸波中的几种新型的树脂基吸波复合材料,如碳/热塑性树脂基复合材料、纤维增强树脂基复合材料、树脂基纳米复合材料。
5) polymer composites
树脂基复合材料
1.
Strength and modulus anisotropy of short fiber reinforced polymer composites;
短纤维增强树脂基复合材料强度和模量的各向异性
2.
As a result of the influence of moisture environments or other severe environments,the mechanical properties of polymer composites will deteriorate with time and make the actual reliability of them lower than that of the pre-designed reliability.
在潮湿环境及其他严酷环境作用下,树脂基复合材料结构的力学性能会逐步降低,使得材料的实际可靠度比预设计的可靠度低。
3.
The influence of low temperature plasma treatments on the chemical and mechanicalproperties of carbon fiber as well as carhon-fiber-reinforced polymer composites are described.
综述了低温等离子体处理对碳纤维(CF)及其增强树脂基复合材料(CFRP)的化学和机械性能的影响,同时也探讨了等离子体技术在纤维复合材料应用中存在的问题和研究方向。
6) resin-based composites
树脂基复合材料
1.
Research progress of effect of temperature on properties of resin-based composites
关于温度对树脂基复合材料性能影响的研究进展
2.
This paper summarizes recent progress in production and studies of resin-based composites and its resin matrixes.
综述了现代树脂基复合材料及其基体树脂的工业和研究进展概况。
3.
The article analyses the general situation of resin-based composites industry in the important production countries, discusses the developing road of composites industry to face the economic construction strengthening the technical development, developing the multifunctional, lower cost composites, new products.
根据世界各国近10年来树脂基复合材料的生产及应用情况,论述了加速研究开发多功能、低成本复合材料新产品并形成产业化是21世纪复合材料工业发展的必由之路。
补充资料：氮化硅晶须补强碳化硅陶瓷基复合材料
分子式：
CAS号：
性质：以碳化硅陶瓷为基体，以氮化硅晶须为增强体的复合材料。它既保留了碳化硅陶瓷优良的耐高温、抗蠕变、抗氧化、抗化学腐蚀、耐磨等性能，又具有比碳化硅陶瓷更高的强度和韧性，最高使用温度可达1400℃以上。由于氮化硅晶须与碳化硅陶瓷基体具有较好的物理相容性，化学性质相近，界面的结合力较强。该复合材料的烧结温度高，界面控制困难，成本高，主要用于航空、航天领域的高温部件。
CAS号：
性质：以碳化硅陶瓷为基体，以氮化硅晶须为增强体的复合材料。它既保留了碳化硅陶瓷优良的耐高温、抗蠕变、抗氧化、抗化学腐蚀、耐磨等性能，又具有比碳化硅陶瓷更高的强度和韧性，最高使用温度可达1400℃以上。由于氮化硅晶须与碳化硅陶瓷基体具有较好的物理相容性，化学性质相近，界面的结合力较强。该复合材料的烧结温度高，界面控制困难，成本高，主要用于航空、航天领域的高温部件。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条