In order to obtain the experiential formulas and characteristic factors of dynamic cushion curves and provide basic data for utilizing X-PLY corrugated paperboard in transportation packaging,dynamic cushioning properties of X-PLY(A) and X-PLY(B) corrugated paperboard were investigated by drop shock experiments.

By applying the drop testing machine to automatically simulate half-sine pulse,the calculating model was set up to describe the course of half-sine pulse generated by the rubber waveform generator,based on the basic mechanical principle of half-sine pulse generation and non-linear of the rubber waveform generation in the condition of quasi-static compress.

A 3-D FE model was established in order to investigate dynamic responses of the round PCB and find the weakness of solder joint in packaging under drop impact.

With increase in electronic package density,the reliability of a board-level package under drop impact load becomes a key issue.

Drop direction is an important parameter of drop impact,this paper presented a new method to measure drop direction and introduced the basic structure,measurement circuit and principle of the sensor.