Based on a typical forced air cooling electronic equipment,the accuracy and reliability of heat analysis module of electronic equipment structure optimization supporting software are proved through comparing the test data with the simulated results.

Aiming at the thermal design problem of high-power components in electronic equipments, this paper introduces one practical thermal design method of forced air cooling of electronic equipment.

The paper introduced the technology research project in international public bidding of 2×1 000 MW forced air-cooling enclosed bus for Phase 2 of Guangdong Lingao Nuclear Power Station.

With the advantages of convenience of design, ease of application and low cost, forced air-cooling with heat sinks and fans are now the most widely used cooling technology for electronic devices.

The forced air-cooling enclosed bus-bar is the development trend of the enclosed bus-bar.

This paper has created the heat balance equation and analyzed the temperature rising law of forced air-cooled enclosed bus-bar mainly from the perspective of generating heat.

A forced-air cooling system for a 230W power amplifier module is introduced in this paper,as well as the CFD software simulation of the cooling performance.

The heat transfer characteristics of two kinds of heat sinks, plain plate fins and sub-sectioned plain plate fins, are experimentally measured to investigate the forced cooling capacity of the heat sinks under different power input and approaching velocity.