Preparation and properties of epoxy resin/ZrW_2O_8 packaging materials;

Research on epoxy-based packaging material based on magnetic core;

Novel 60Si40Al alloy packaging material by spray forming process;

Novel packaging materials and thermal management of high-power LED packaging;

For the large quantity and variety of packaging materials in MEMS,it is difficult to use and deal with the data of packaging materials.

According to the requirements of the packaging materials in flexible display, the types and application researches status of flexible substrate materials were summarized, the research progress of flexible polymer substrate materials was stressed.

The encapsulation technology of the photovoltaic module was mainly discussed,including the encapsulation process,process control,encapsulation materials,and the selection of the encapsulation materials and equipment,and some key problems in the encapsulation technology were emphatically discussed.

The encapsulation materials used in a solar cell is likely to get yellow because of being aged, thus leading to a reduction in the efficiency of a solar cell.

In the paper,resin material,the transfer molding mechanism,craft process and control as well as the mold of plastic capsulation of microelectronic components are analyzed and researched.

Account of package materials of MEMS, including ceramics, plastic, metal material and metal compound material, etc was given.

The reliability of integrated circuit packages were discussed in terms of package materials and styles.