1.
Research Progress of Diamond-Cu Composite Material for Electronic Packaging
电子封装材料用金刚石/铜复合材料的研究进展
2.
Current Situation of High-Power LED Encapsulant
大功率LED器件封装材料的研究现状
3.
Progress of Anisotropic Conductive Adhesive for Flip Chip Packaging
倒装芯片封装材料—各向异性导电胶的研究进展
4.
Studies show that water vapor quickly permeates plastic packaging material.
研究证明水蒸汽能迅速渗入塑料封装材料。
5.
Moisture Absorption Property of Material and Moisture&Thermal Affects on Package's Reliability
封装材料的吸湿特性及湿、热对封装器件可靠性的影响
6.
Thermophysical Properties of Aluminum Infiltrated Silicon Carbide for Electronic Packaging;
铝渗碳化硅电子封装材料的热物理性能
7.
Study on Electronic Encapsulation Material Basied on Benzoxazine Resin;
苯并噁嗪树脂在电子封装材料中的应用研究
8.
The Structure and Properties of Al/SiCp Composites Preparated by Pressureless Infiltration for Electronic Packaging;
无压浸渗制备Al/SiCp电子封装材料的结构与性能
9.
Investigation on Al/SiCp Electronic Packaging Materials Fabricated by Gas Pressure Infiltrating Processes;
气压浸渗法制备Al/SiCp电子封装材料的研究
10.
Status and development direction of automobile electronics and its encapsulation materials
汽车电子产品及其封装材料的现状与发展方向
11.
Study on CFRP Encapsulating Fiber Bragg Grating Sensor;
碳纤维复合材料封装FBG传感器研究
12.
Study on the Encapsulation of Organic Light-emitting Diode Materials with AAO;
AAO模板封装有机电致发光材料的研究
13.
Electron-induced Damage of CMOS with Shielded Packages
屏蔽材料封装CMOS器件的电子辐照损伤
14.
The Preparation and Characteration of Organic Silicone Encapsulant
封装用有机硅材料的制备及性能研究
15.
Advance in Silicone Materials for LED Encapsulation
LED封装用有机硅材料的研究进展
16.
Application and Development Trend of Envelope Materials in Military Equipment Preservative Packaging
封套材料在军用装备封存包装中的应用及发展趋势
17.
Optimization of Heat Sink Encapsulated with Phase Change Material for High Temperature Ambient
高温环境下封装有相变材料的热沉结构优化
18.
The Research on Properties of SiC_p/Al Composite for Electronic Packaging;
电子封装SiC_p/Al 复合材料性能及影响因素研究