1) via filling
封孔镀
1.
The mechanism of JGB during copper via filling process was investigated by means of electrochemical polarization and electrochemical impedance (EIS) measurement.
采用极化曲线和电化学交流阻抗法测试,研究了封孔镀铜过程中整平剂JGB的作用机理,同时利用质谱和液体核磁共振谱确定了通电过程中JGB分解产物A的结构。
2) electroless plating of pove sealing
封孔化学镀
3) hole sealing
封孔
1.
Problems encountered in slim hole sealing are analyzed.
分析了小口径钻孔封孔中存在的问题，从理论上提出中深孔封孔的技术措施，经近百个钻孔的实际应用和透孔检验，验证了小口径中深孔水泥封孔技术措施的可行性。
4) sealing
[英]['si:liŋ] [美]['silɪŋ]
封孔
1.
Effects of hot water sealing on corrosion resistance of anodic films on Mg alloy;
热水封孔对镁合金阳极氧化膜耐蚀性能的影响
2.
This paper summarizes the way to decrease the coating porosity ratio and make a prospect of the sealing technology.
因此,封孔处理是提高涂层防腐蚀性能的重要途径。
3.
The cause of the coating porosity and the aim of the sealing treatment are summarized ,the way to decrease the coating porosity is introduced and the development of the sealing technology in the future is analyzed.
封孔处理是提高涂层防腐蚀性能的重要途径。
5) via
[英]['vaɪə] [美]['vaɪə]
通孔;镀通孔
补充资料：第二孔(继发孔)型缺损
第二孔(继发孔)型缺损
ostium secondary defect
是心房间隔在形成上发生障碍，一般缺损较大，多在卵圆孔附近称第二孔(继发孔)型缺损。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条