1.
Research on acidic copper additives used in through-hole plating of PCB manufacture
印制电路板中通孔电镀铜添加剂的研究
2.
Micro-via Filling and Through Hole Plating in one Process in Vertical Line
垂直电镀线盲孔和通孔同步电镀工艺
3.
Cupric Sulfate Plating Process Cu-BRITE TFⅡ for Through-Hole and Via Filling Plating
导通孔和通孔填孔镀用的CuSO_4电镀工艺“Cu-BRITE TFⅡ”
4.
To galvanize or plate(metal)by immersion.
电镀通过浸泡镀涂金属
5.
To coat with tin, either by dipping or electroplating.
镀锡在…镀锡，通过浸染或电镀的方式
6.
Causes and Reduction Countermeasures of Porosity in Electrolytic Tinplate
电镀锡钢板孔隙成因及降低对策研究
7.
Pure nickel deposits were obtained from the traditional Watt nickel plating bath by pulse electroplating .
采用传统的瓦特镀液通过脉冲电镀制得纯镍镀层。
8.
The electrographic test method of plating porosity for printed boards
GB/T4677.9-1984印制板镀层孔隙率电图象测试方法
9.
Reliability of plated through hole (PTH) has close relationship with technology parameters during manufacture process.
镀通孔的可靠性与制造过程工艺参数有非常密切的关系。
10.
Micro-resistance test method of plating thickness of platedthrough holes for printed boards
GB/T4677.2-1984印制板金属化孔镀层厚度测试方法微电阻法
11.
Study on Preparation and Application Technology of Deep and Small Hole Finishing Electroplating Honing Tools;
小直径深孔精加工电镀珩具制备及应用技术研究
12.
To give a glossy finish to(paper)by pressing between metal sheets or rollers.
电镀通过金属板或滚筒之间的挤压给（纸）抛光
13.
Electro galvanized Steel Sheet
电镀锌(电解)钢片
14.
For applications with pitches below 0.5 mm, choices are limited to laser cutting or electroforming.
制造过程电抛光和电镀处理的激光刻录的孔壁，改善了锡膏转移的效果。
15.
Effects of each component content in solution, process conditions, power source on appearance of Sn deposit were studied by Hull Cell test.
通过赫尔槽试验研究了镀液中各成分含量、操作条件及电源对镀层外观的影响。
16.
Experimental Research of Micro-EDM for Through-Silicon-Via
硅阵列通孔微细电火花加工试验研究
17.
Study on Sealing Technology and Corrosion Resistance of Ni-P Electroless Deposit
化学镀镍磷合金镀层封孔工艺及耐蚀性能研究
18.
Electroplating process for the die made of Al is presented.
介绍了铰刀制造过程中，在铝质胎具内孔电镀的工艺过程和部分参数。