1) Ferronickel
覆铜
2) copper clad panel
覆铜板
1.
The effects of the feed ratio of raw materials, reaction temperature and the dosage of catalyst, etc factors on the new synthesis process of brominated epoxy resin for copper clad panel were studied.
研究了原料配比、反应温度、催化剂等因素对覆铜板专用溴化环氧树脂合成新工艺的影响。
3) CCL
覆铜板
1.
Research on the Laminate of Blends Based on Benzoxazine and Hydantoin Epoxy Resins Used in CCL;
BZ/EP树脂基覆铜板基板材料的研究
2.
Research on Halogen-free and Non-phosphorus Flame-retardant Key Resin Materials Used in CCL;
无卤无磷阻燃覆铜板关键树脂材料的研究
4) Copper Clad Laminate
覆铜板词:
5) printed circuit board
覆铜箔板
1.
The manufacturing process and application of the printed circuit board paper are briefly introduced in this paper.
介绍了覆铜箔板纸的用途,覆铜箔板的制造过程和应用。
2.
It has been demonstrated that the recycled particle from printed circuit board waste can be used as a filler aod reinforcement in thermoplastic PP, PE, PVC and thermosetting BMC.
本文介绍了覆铜箔板废料的回收处理路线,研究了其回收粒料对热塑性PP、PE、PVC和热固性 BMC填充和增强的作用。
6) Laminate
覆铜板
参考词条
补充资料：覆铜膜
分子式：
CAS号：
性质： 由聚酯、聚酰亚胺、聚四氟乙烯、聚苯醚等塑料薄膜与铜箔用胶黏剂胶接层压而成的复合膜。常用的胶粘剂有丙烯酸酯、环氧-丁腈、环氧-聚氨酯等胶粘剂。主要用于制造软性印刷线路板、软性印刷电缆及大型平板电容器等。
CAS号：
性质： 由聚酯、聚酰亚胺、聚四氟乙烯、聚苯醚等塑料薄膜与铜箔用胶黏剂胶接层压而成的复合膜。常用的胶粘剂有丙烯酸酯、环氧-丁腈、环氧-聚氨酯等胶粘剂。主要用于制造软性印刷线路板、软性印刷电缆及大型平板电容器等。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。