1) CEM-3 copper clad laminates
CEM-3覆铜板
2) copper clad panel
覆铜板
1.
The effects of the feed ratio of raw materials, reaction temperature and the dosage of catalyst, etc factors on the new synthesis process of brominated epoxy resin for copper clad panel were studied.
研究了原料配比、反应温度、催化剂等因素对覆铜板专用溴化环氧树脂合成新工艺的影响。
3) CCL
覆铜板
1.
Research on the Laminate of Blends Based on Benzoxazine and Hydantoin Epoxy Resins Used in CCL;
BZ/EP树脂基覆铜板基板材料的研究
2.
Research on Halogen-free and Non-phosphorus Flame-retardant Key Resin Materials Used in CCL;
无卤无磷阻燃覆铜板关键树脂材料的研究
4) printed circuit board
覆铜箔板
1.
The manufacturing process and application of the printed circuit board paper are briefly introduced in this paper.
介绍了覆铜箔板纸的用途,覆铜箔板的制造过程和应用。
2.
It has been demonstrated that the recycled particle from printed circuit board waste can be used as a filler aod reinforcement in thermoplastic PP, PE, PVC and thermosetting BMC.
本文介绍了覆铜箔板废料的回收处理路线,研究了其回收粒料对热塑性PP、PE、PVC和热固性 BMC填充和增强的作用。
5) Laminate
[英]['læmɪnət] [美]['læmənət]
覆铜板
1.
Introduce Hi-pot test into ultra-thin laminate test envelope to research the influence of test condition,design a set of Hi-pot test instrument available for ultra-thin laminate.
在超薄覆铜板的测试项目中引入耐电压测试,设计了一套符合覆铜板特点的耐电压测试装置,借由这套装置开展了对耐电压测试条件和影响因素的研究。
6) copper-clad laminate
覆铜箔板
1.
It was confirmed that convention fabrication process for FR-5 laminate was applicable to copper-clad laminates fabrication for the epocy-silicon hybrid resin.
概述了基于新概念的环氧-硅复合树脂的开发,并证实了传统FR-5基材的制造工艺可以适用于环氧-硅复合树脂的覆铜箔板制造。
2.
This paper describes the requirment,characteristic and application of low thermal expansion high elastic modulus glass epoxy copper-clad laminat
概述了低热膨高弹性模量覆铜箔板的必要性、特征和用途。
补充资料：铜板
1.铜元。 2.铜制板材。 3.铜版。 4.铜制的演唱快书等打拍子用的板状器具。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条