1) Photo-electron devices
充电子器件
2) electron device
电子器件
1.
A neural network method for modeling nonlinear electron devices based on RBF;
基于RBF神经网络的非线性电子器件的建模方法研究
2.
The vacuum microwave electron devices will continue to be used in the defense equipments in the future 30 years and more longer.
本文综述了近十年来微波真空电子技术进展,由于其在现代军事装备中的重要作用和近十年来技术上取得的进步,使微波真空电子器件在未来30年中仍然是国防装备的核心器件。
3) electronic device
电子器件
1.
Research progress of intermediate temperature solder for electronic device;
电子器件用中温钎料的研究进展
2.
Advances in application of thermal adaptation composite materials in electronic device cooling;
热适应复合材料应用于电子器件散热的研究进展
3.
676 W/(m · K) was then applied to the heat sinks of electronic devices.
将该材料应用于电子器件散热装置,在不同的发热功率条件下,储热材料散热实验系统的表观传热系数是传统散热系统的1。
4) electronics
[英][ɪ,lek'trɔnɪks] [美][ɪ'lɛk'trɑnɪks]
电子器件
1.
Applications of micro heat pipes in electronics cooling;
微热管在电子器件冷却中的应用
2.
Heat dissipation of electronics and cooling techniques;
电子器件发热与冷却技术
3.
However, Air jet coming from tiny diameter circular jet and impinging on the heat transfer surface with middle and low Reynolds number and its application to cooling electronics were studied in this paper.
当今电子器件的正向朝着高集成度、微型化、高功耗的方向发展,其热流密度迅速提高,电子设备过热或热缺陷是电子产品失效的主要原因之一,所以冷却问题成为制约其发展的一个瓶颈。
5) electronic component
电子器件
1.
For efficiently cooling electronic components, experiments were conducted to study the pool boiling heat transfer performance of FC-72 over silicon chips with surface microstructures.
针对电子器件的高效冷却问题,对表面加工有微结构的硅片上FC-72的池沸腾换热性能进行了实验研究。
2.
In this paper not only the application of the principles of photoacoustics in electronic component are introduced,including measure thermal diffusivity?surface defect?the mixed density of semiconductor?thickness and study the surface electric property,but also their research status and developing prospects are described in brief.
综述了光声技术理论在电子器件中的应用 ,包括 :测量热扩散率、表面缺陷、半导体掺杂浓度、厚度及研究表面电性质等 。
3.
Now the heat flow density of electronic component is up to 104W/m2-105 W/m2, and is increasing continually and rapidly.
近年来,随着电子工业技术的迅猛发展,电子器件由于高速、高频化,导致发热量的增加。
6) electronic devices
电子器件
1.
Simulation of thermal deformation is significant to enhance thermal reliability of electronic devices.
电子器件热变形的模拟对于提高器件的热可靠性有着重要意义 。
2.
Due to their stronger quantum-confined effects,quantum dot structures in o p toelectronic and electronic devices are expected to have superior device perform ance levels than quantum well structures.
由于其较强的量子效应 ,量子点结构的光电器件和电子器件有望比量子阱结构的器件具有更好的性能。
补充资料：充电
分子式：
CAS号：
性质：蓄电池从外电路接受电能，转化为电池的化学能的工作过程。蓄电池在其能量经放电消耗后，通过充电恢复，又能重新放电，构成充放循环。一般用直流电流(也有用不对称交流电流或脉冲电流)充电。不同情况下，采用不同的充电方法如恒流充电、恒电压充电、浮充电、涓流充电、急充电或这些方法的组合式充电等。
CAS号：
性质：蓄电池从外电路接受电能，转化为电池的化学能的工作过程。蓄电池在其能量经放电消耗后，通过充电恢复，又能重新放电，构成充放循环。一般用直流电流(也有用不对称交流电流或脉冲电流)充电。不同情况下，采用不同的充电方法如恒流充电、恒电压充电、浮充电、涓流充电、急充电或这些方法的组合式充电等。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条