1) contact pressure
接触压强
1.
Pushing of the shaft for the contact pressure profile and the influence of the relative position of the hydraulically assembled shaft and sleeve are stressed and considered in the calculations.
介绍了用有限元法计算盘磨机轴的接触压强，所得数值及分布规律是可靠的；并讨论了轴压入量与直径过盈量及配合长度的关系。
2.
An uneven contact pressure between the wire and pad is indicated,which explains the welding formation in experi.
本文采用弹塑性、大变形的非线性有限元方法,模拟了超声波线焊的过程,分析了接触界面的接触压强分布,发现不均匀的接触压强分布是导致这种焊点形态的主要原因。
3.
The distribution law of contact pressure between flange and gasket is presented.
采用接触有限元方法,计算了螺栓、法兰和垫片三者之间的相互作用,给出了法兰和垫片间接触压强的分布规律,指出了考虑法兰接头密封时管道内压是一个不可忽略的计算因素,验证了螺栓之间的区域为密封的薄弱环节。
2) contact pressure distribution
接触压强分布
1.
Then,the contact pressure distribution was calculated and analyzed in polishing experiments using ANSYS.
为了获得单晶硅片化学机械抛光过程中护环对接触压强分布的影响规律,从有护环化学机械抛光实际出发,建立了抛光过程的接触力学模型和边界条件,利用有限元法对有护环抛光接触状态时的接触压强分布进行了计算和分析,并利用抛光实验对计算获得结果进行了验证。
2.
In order to obtain the effect of carrier film on contact pressure distribution in the chemical-mechanical polishing(CMP) of silicon wafer,a mechanism model and a boundary equation were set up,then the contact pressure distribution was calculated and analyzed by use of finite element method,and the calculated result was verified by polishing experiments.
为了获得单晶硅片化学机械抛光过程中背垫对接触压强分布的影响规律,建立了有背垫抛光过程的接触力学模型和边界条件,利用有限元方法进行了有背垫时的接触压强分布的计算与分析,并利用抛光实验对计算结果进行了验证,获得了硅片与抛光垫的接触表面压强分布形态,以及背垫的物理参数对压强分布的影响规律。
3.
In order to obtain the contact pressure distribution and its effect on the flatness errors of aluminum hard magnetic disc substrates,based on the lapping practices of the substrates,the elastic contact mechanical model and boundary conditions between the substrate and PVA fixed abrasive stones are established when the substrate is lapped.
目的为了获得铝质硬磁盘基片研磨过程中的接触压强分布对基片平面度的影响规律。
3) face contact
接压接触
4) contact strength
接触强度
1.
Study on the contact strength calculation of standard cylindrical spur gear transmission;
标准直齿圆柱齿轮传动接触强度计算的研究
2.
The paper deals with the contact strength problem of tractive mechanism of shearer by the finite element parametric quadratic programming method.
本文应用有限元参数二次规划法求解采煤机牵引行走机构齿轨接触强度问题,介绍了有限元建模和网格划分,分析了计算结果。
3.
Additionally, it has advantages of higher contact strength, wearproof and efficiency in transmission.
同时具有接触强度高,耐磨损,传动效率高等优点。
5) contact intensity
接触强度
1.
The contact intensity formulations of the external wave sliding-toothreducer were discussed and derived theoretically based on referencesl[1￣3].
研究推导了外波式活齿减速器中接触强度的计算公式。
2.
Finally from the cylindrical gears material quality,the tooth face contact intensity and the tooth root bending strength three aspect multianalysis the measure which anti-transmission expired,has given the gear strength calculation formula.
最后从圆柱齿轮材质、齿面接触强度和齿根弯曲强度三个方面详细分析了抗传动失效的措施,给出了齿轮强度计算公式。
6) contact pressure
接触压力
1.
Calculation of contact pressure on TM and VAMACE premium connection casing couplings;
TM和VAMACE特殊螺纹套管接箍接触压力计算
2.
The effect of articular step-off and neniscectomy on joint alignment and contact pressures for fractures of the lateral tibial plateau;
胫骨外侧髁骨折塌陷对关节轴线及接触压力的影响
3.
Single chip microcomputer-based inspection of catenaries-pantograph contact pressure;
基于单片机的弓网接触压力检测
补充资料：等离子体压强和磁压强
在流体近似下，可以把等离子体看成是彼此相互作用的电子和离子两种气体的混合物。它们各具有动力压强,上述两种气体成分的分压强之和P=k(niTi+neTe)称为等离子体压强，k是玻耳兹曼常数,角标i、e分别表示离子和电子。
经常遇到的处在静磁场 B中的等离子体，除了等离子体压强外，它还受到磁力 作用，j是电流密度。当磁力线是直的并互相平行时，(B·墷)B项等于零，相当于压强，称为等离子体磁压强。
在等离子体压强和磁压强并存之时，常用参数表示磁压强的相对重要性。这个参数称为比压。
经常遇到的处在静磁场 B中的等离子体，除了等离子体压强外，它还受到磁力 作用，j是电流密度。当磁力线是直的并互相平行时，(B·墷)B项等于零，相当于压强，称为等离子体磁压强。
在等离子体压强和磁压强并存之时，常用参数表示磁压强的相对重要性。这个参数称为比压。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条