1) Cu-7Al single crystal
Cu-7Al单晶体
2) copper single crystal
Cu单晶体
1.
The saturation dislocation microstructures in a [013] orientated copper single crystal during fatigue in air and NaCl aqueous solution were observed by electron channeling contrast (ECC) technique in SEM and TEM.
利用扫描电镜电子通道衬度技术(SEM-ECC)和透射电子显微镜(TEM)对[013]取向Cu单晶体在空气中和NaCl水溶液中疲劳到饱和的位错结构进行观察。
3) Cu single crystal
Cu单晶
1.
The mechanisms of micro stick-slip phenomenon were investigated with the 3D molecular dynamics simulation (MDS) of single-asperity dry friction on the surface of Cu single crystal.
运用分子动力学方法模拟了Cu单晶在微摩擦过程中的黏-滑效应。
4) copper single crystal
Cu单晶
1.
SEM-ECC technique was employed to observe and characterize the dislocation mi-crostructures during the saturation stage of cyclic deformations in a copper single crystal.
利用扫描电镜电子通道衬度(SEM-ECC)技术观察了循环变形饱和阶段Cu单晶样品中近表面区域的位错微结构。
2.
The effect of boundary conditions on computer simulating dislocation patterns of a fatigued copper single crystals was studied by using the method of discrete dislocation dynamics in two-dimensional system.
利用二维离散位错动力学方法,研究了边界条件对计算机模拟疲劳Cu单晶位错花样的影响,结果表明:边界条件在模拟位错花样这类多体问题时是非常重要的;在其它模拟机制均完全相同的情况下,不同边界条件会形成不同的模拟结果,自由空间边界条件是最简单、也是最不现实的边界条件,模拟结果与实验结果相差甚远;而一维最近邻周期性边界条件与二维近邻周期性边界条件的模拟结果基本相同,与Cu单晶早期疲劳位错花样的实验比较吻合。
5) Cu-based single crystal
Cu基单晶
6) single crystal Cu
单晶Cu
1.
The processes of initial plastic deformation of single crystal Cu in nanoindentation are simulated by using quasicontinuum method.
采用准连续介质方法模拟了纳米压痕实验中单晶Cu初始塑性变形过程。
2.
agglomeration, of nano single crystal Cu ball and amorphous SiO2 ball.
本文的最后一部分介绍我们的另一个研究结果,用分子动力学研究单晶Cu冲击加载后的卸载熔化,从一个新的角度,原子角度去展示卸载熔化过程。
3.
Based on the large scale parallel algorithm,a new three dimensional molecular dynamics simulation model was established for nanomachining of single crystal Cu.
基于大规模并行算法建立了单晶Cu纳米加工新型三维分子动力学仿真模型,采用Tersoff势、嵌入原子势(embeddedatom method,EAM)和Morse势分别描述刀具原子之间、工件原子之间和工件与刀具原子之间的相互作用。
补充资料：A1-Cu-Co合金中十次对称准晶单晶体及其衍射图
A1-Cu-Co合金中十次对称准晶单晶体及其衍射图
‘ Al Cu—Co合金中十次对称准晶堕晶体e1)及其衍射圈(z) 中国科学盹垒禹研览听供稿
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
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