1) copper colloids
铜胶
1.
This paper describes the synthesis of copper colloids which are protected by surfactant.
以十二烷基硫酸钠 (SDS)作保护剂 ,肼作还原剂 ,在硫酸铜溶液中加入相当于铜物质的量含量 1 %的 Au Cl-4离子 ,金先被还原出来作为金核 ,后续还原的铜沿着金表面生长 ,从而制备出直径 5 nm左右较均匀的铜纳米颗粒 ,溶液中过量肼的存在可以使铜胶保持还原态 。
2) copper colloid
铜胶体
1.
Ti3+ was employed as shielding effect agent to prepare stabilized dispersed copper colloid by disproportionating reaction of Cu+.
随后通过Cu+的歧化反应制备了稳定分散的铜胶体。
2.
01 percent of total copper can effectively prevent the copper colloid from oxidation.
制备了纯金属铜胶体，并用金对其表面进行修饰，用热重和紫外可见吸收光谱对铜胶体表面修饰反应及铜胶体在空气中的氧化进行了研究。
3) colloidal copper
胶体铜
1.
This paper studies the methods and reaction conditions for the preparation of colloidal copper catalysts without N_2 protection.
研究了无氮气保护下胶体铜催化剂的制备方法和反应条件,在聚乙烯吡咯烷酮(PVP)保护下,用水合肼还原CuCl2,在80℃和pH=7。
2.
Colloidal copper particles were prepared by reducing copper(Ⅱ) chloride solution with the mixed solution of hydrazine hydrate and sodium hydroxide in the presence of stabilizer polyvinyl pyrrolidone(PVP).
研究了胶体铜催化丙烯腈水合制丙烯酰胺的高选择性与活性中心结构的关系。
4) nickel/copper colloids
镍/铜胶体
5) Microcapsule copper
微胶囊铜
1.
Microcapsule copper is made by using surfactant of egg glairs to enwrap fresh copper particle produced in reaction.
采用卵蛋白表面活性剂,经包覆反应过程中新生金属铜微粒制作出微胶囊铜。
2.
Nanometer microcapsule copper were synthesized with chemical reaction, and its tribological properties are investigated with four - ball tester in mineral oil, the results show that the additive has good extreme - pressure (EP) , and - wear (AW) and friction - reduction properties.
用化学方法制备了纳米微胶囊铜润滑添加剂,通过四球机考察了其在矿物油中的摩擦学性能,结果表明:纳米微胶囊铜润滑添加剂具有优良的减摩、抗磨和极压性能。
6) Copper conductive adhesive
铜导电胶
1.
Copper conductive adhesive is prepared by using modified resins and mixed resins as cohesive materials and Copper powders as conductive fillers.
以改性树脂和混合树脂为粘料，铜粉为导电性填料，并配以适当添加剂、固化剂制备铜导电胶。
补充资料：铜粉充填型导电胶
分子式：
CAS号：
性质：以铜粉作为导电粒子添加到胶黏剂中制得的导电胶。铜粉价格较便宜，在空气中易被氧化，稳定性较差，只能使用在要求不很高的产品上。一般电阻率在10-3Ω·cm数量级。
CAS号：
性质：以铜粉作为导电粒子添加到胶黏剂中制得的导电胶。铜粉价格较便宜，在空气中易被氧化，稳定性较差，只能使用在要求不很高的产品上。一般电阻率在10-3Ω·cm数量级。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条