1) copper powder electric conductive adhesive
铜粉导电胶
1.
This paper studies the effect of the formulation of the cold curing epoxy copper powder electric conductive adhesive, curing temperature, curing velocity, using temperature pot life and storage life on the properties of the adhesive.
本文研究了冷固化环氧型铜粉导电胶的配比、固化温度、固化速度、使用温度、各种介质、适用期和贮存期对性能的影响。
2) copper powder filled conductive adhesive
铜粉充填型导电胶
3) Copper conductive adhesive
铜导电胶
1.
Copper conductive adhesive is prepared by using modified resins and mixed resins as cohesive materials and Copper powders as conductive fillers.
以改性树脂和混合树脂为粘料，铜粉为导电性填料，并配以适当添加剂、固化剂制备铜导电胶。
4) mesh copper powder conducting resi
网格铜粉导电树脂
5) Electrolytic copper powder
电解铜粉
1.
Effect of electrolytic copper powder and atomizing copper powder to microstructure evolution during SPS;
电解铜粉和雾化铜粉对SPS过程中显微组织演变的影响
2.
The processes of oxidation-reduction of electrolytic copper powder were experimentally studied to prepare the copper powder with low apparent density.
对电解铜粉的氧化、还原过程作了实验研究。
6) Copper-foil conducting electricity
导电铜箔
补充资料：铜粉充填型导电胶
分子式：
CAS号：
性质：以铜粉作为导电粒子添加到胶黏剂中制得的导电胶。铜粉价格较便宜，在空气中易被氧化，稳定性较差，只能使用在要求不很高的产品上。一般电阻率在10-3Ω·cm数量级。
CAS号：
性质：以铜粉作为导电粒子添加到胶黏剂中制得的导电胶。铜粉价格较便宜，在空气中易被氧化，稳定性较差，只能使用在要求不很高的产品上。一般电阻率在10-3Ω·cm数量级。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条