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1)  thermal stress relaxation
热应力缓和
1.
The design of Ni/ Ni 3Al-TiC functionally gradient materials with thermal stress relaxation is fulfilled by analysing the result of the finite element simulation.
在综合考虑热应力最小、应力强度比值最小以及纯TiC侧应力状态等因素的基础上,完成了FGM体系的热应力缓和特性设计,得到组成分布指数P=1。
2.
The thermal stress relaxation of PSZ-Mo functionally gradient material(FGM)during the fabri-cation process is optimally designed.
对PSZ-Mo系梯度功能材料(functionallygradientmaterials简称FGM)在制备过程中的热应力缓和性能进行了优化设计,用有限元方法解析了PSZ-Mo系两层叠层材料(即非梯度功能材料)在制备过程中的热应力分布情况。
2)  stress relaxation layer
应力缓和层
1.
The comparison analysis of the experiments show that the activated filler metal with the addition of Ti is suitable to directory brazing of Si3N4/steel, and adopting right stress relaxation layer and seal configuration will increase the joint strength obviously.
表明,含Ti活性钎料适用于Si3N4/钢的直接钎焊;合适的应力缓和层的选择以及套封结构的使用均能明显提高钎接接头强度。
3)  Alleviating thermal stress
缓解热应力
4)  stress relieve
应力解除[缓和]
5)  Ti stress relaxation layer
Ti应力缓和层
1.
In addition,in order to improve more the adhesion strength of Ti-doping diamond-like carbon(Ti-DLC) thin films,Ti stress relaxation layers were introduced in Ti-DLC thin film and form a Ti/Ti-DLC/Ti/Ti-DLC……soft and hard alternative multilayer thin film.
研究了Ti掺杂对磁控溅射类金刚石(DLC)薄膜附着力及硬度的影响,同时在Ti掺杂类金刚石(Ti-DLC)薄膜的基础上,通过引入Ti应力缓和层制备了Ti/Ti-DLC/Ti/Ti-DLC……软硬交替多层薄膜,研究了Ti应力缓和层对进一步提高薄膜附着力特性的作用。
6)  stress relieving (SR)
应力缓和,应力消除
补充资料:轧辊残余应力(见轧辊应力)


轧辊残余应力(见轧辊应力)
residual stresses in roll

zhagun eanyu yingli轧辊残余应力(residual stresses in roll)见礼辐应力。
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
参考词条