1) Hypophosphite
[英][,haipə'fɔsfait] [美][,haɪpə'fɑsfaɪt]
次亚磷酸根
1.
Mechanistic Study of Oxidation of Hypophosphite on Pt Electrodes by SNIFTIRS;
次亚磷酸根离子在铂电极上氧化的机理研究(英文)
2) hypophosphite
[英][,haipə'fɔsfait] [美][,haɪpə'fɑsfaɪt]
次亚磷酸根离子
1.
The electrochemical oxidation of hypophosphite ions on polycrystaline Pt electrode in both acid and alkaline solutions has been studied by SNIFTIRS(Subtractively Normalized Interfacial FTIR Spectroscopy) and cyclic voltammetry, and compared with that on Ni electrode.
用SNIFTIRS和循环伏安法研究了酸性溶液和碱性溶液中次亚磷酸根离子在铂电极上的电氧化行为 ,并与镍电极上的反应比较。
2.
The electrochemical oxidation of hypophosphite ions in 0.
1mol/LNaOH溶液中次亚磷酸根离子在铂和镍两种电极上的电氧化行为。
3) Hypophosphite
[英][,haipə'fɔsfait] [美][,haɪpə'fɑsfaɪt]
次磷酸根
1.
Hypophosphite, H_2PO_2~-, is one of the most widely used reductant in the electroless depositions.
本论文使用Gaussian03W软件，采用了密度泛函理论(DFT)和簇模型的方法研究了次磷酸根在Ni(111)，Pd(111)，Pt(111)和Cu(111)，Ag(111)，Au(111)金属表面上的吸附过程。
5) sodium hypophosphite
次亚磷酸钠
1.
Poly(maleic anhydride/sodium hypophosphite)——PMAH/SHP used as a non-formaldehyde wrinkle-resistant finishing agent for cotton fabric was synthesized with maleic anhydride and sodium hypophosphite in aqueous polymerization.
以马来酸酐、次亚磷酸钠为原料,采用水相聚合方法,制备了棉织物无甲醛抗皱整理剂——聚马来酸酐/次亚磷酸钠(PMAH/SHP)。
2.
Thus a new bath mainly composed of nickel sulfate, nickel chloride, sodium hypophosphite, boric acid, and sodium fluoride.
对几种电镀镍磷合金镀液进行比较,通过中性盐雾试验,全浸泡腐蚀试验,镀层孔隙率、结合力和硬度测试,得到溶液的主要成分为硫酸镍、氯化镍、次亚磷酸钠、硼酸、氟化钠,并研究了次亚磷酸钠的含量和阴极电流密度对镀层硬度和耐蚀性的影响。
3.
The mechanism of electroless nickel deposition in sodium hypophosphite bath is discussed.
探讨了次亚磷酸钠体系化学镀镍沉积机理。
6) hypophosphite
[英][,haipə'fɔsfait] [美][,haɪpə'fɑsfaɪt]
次亚磷酸盐
1.
Using the method of Algal Growth Potential Test, the effects of phosphine and its oxidation products, such as phosphite and hypophosphite, on the growth of Microcystis aeruginosa, one of the dominant algae during water bloom seasons, were examined.
采用藻类生长潜力试验(AGP)的方法,研究了磷化氢及其氧化产物亚磷酸盐、次亚磷酸盐对水华暴发优势藻类(铜绿微囊藻)的生长的影响,结果表明:磷化氢及其氧化产物对铜绿微囊藻的生长有重要的影响。
2.
Electroless gold plating using sodium hypophosphite as reducing and potassium thiocyanateas chelate is studied in this paper .
研究了以硫氰化物为络合剂，次亚磷酸盐为还原剂的新型无氰化学镀金工艺，探讨了各因素对化学镀金镀速的影响关系，并得出最佳配方及工艺条件，在最佳条件下，镀速可达到２。
补充资料：次亚磷酸钾
分子式：KH2PO2
分子量：104.08
CAS号：7782-87-8
性质：
分子量：104.08
CAS号：7782-87-8
性质：
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条