1) planarization
平整化
1.
Chemical mechanical polishing (CMP) is the only finish machining technique up to date for surface global planarization, which has been widely used for the manufacturing of integrated circuits (IC), hard disk, micro-electromechanical systems (MEMS), optical glass,etc.
化学机械抛光(chemicalmechanicalpolishing,简称CMP)技术几乎是迄今惟一的可以提供全局平面化的表面精加工技术,可广泛用于集成电路芯片、计算机硬磁盘、微型机械系统(MEMS)、光学玻璃等表面的平整化。
2.
Chemical mechanical polishing(CMP) is the only finish machining technique up to date for surface global planarization,which has been widely used for the planarizing of integrated circuits(IC) chip,hard disk,micro-electromechanical systems(MEMS),optical glass,etc.
化学机械抛光技术几乎是迄今唯一可以提供全局平面化的表面精加工技术,可广泛用于集成电路芯片、计算机硬磁盘、微型机械系统(MEMS)、光学玻璃等表面的平整化。
3.
Chemical mechanical polishing(CMP) is the only one global planarization technology for surface precision process,and it can be used on IC chip,computer hard disk,MEMS,substrate materials,metal materials,optics glass and so on surface planarization.
化学机械抛光(Chemical Mechanical Polishing,简称CMP)技术几乎是迄今唯一的可以提供全局平面化的表面精加工技术,可广泛用于集成电路芯片、计算机硬磁盘、微型机械系统(MEMS)、宝石类衬底、金属材料、光学玻璃等表面的平整化。
2) terrain flattening
地形平整化
1.
Moreover,the technique of terrain flattening is employed to improve terrain manipulation.
针对传统的计算机游戏地形仿真方法存在生成效率低下、真实感不强等问题,研究了一种基于改进的热力侵蚀算法的腐蚀化地形生成技术,并通过地形平整化处理以提高地形编辑的简易性。
3) Mean field Renormalization Group (MFRG)
平均场重整化群
4) lead-free HASL
无铅化热风整平
5) electro-chemical mechanical planarization(ECMP)
电化学机械平整化(ECMP)
6) temper rolling
平整
1.
Cross breaks are formed on the surface of cold rolled and tempered strip during temper rolling,which influence the surface quality and mechanical characteristics of the temper rolled strip.
冷轧退火后的带钢在平整过程中产生横折印缺陷,严重影响平整后带钢的表面质量及其力学性能。
2.
The effect of over ageing (OA) and temper rolling on the mechanical properties of cold rolled low carbon SiMn dual phase steel sheets has been studied.
以低碳Si Mn系冷轧双相钢为研究对象,探讨了过时效和平整工艺对双相钢板力学性能的影响。
补充资料：公理化方法(见公理化和形式化)
公理化方法(见公理化和形式化)
axiomatical method
gongllbuafangfa公理化方法化和形式化。(axiomatieal method)见公理
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条