On the basis of the geometric relationships between the preferentially growing direction of dendritic structure and the grinding faces,formulae are deduced to determine the crystal plane indexes of any three intersecting grinding faces of cast alloy samples.

Using double-side grinding technology in 300 mm Si wafer manufacturing process,the Si wafer can obtain high accuracy surface parameters,and generate obvious grinding marks,which can affect the surface flatness.

This paper researched the program design method to control the pages of man-machine interface according to the control forms of automatic cone face grinder.

Based on the state-of-the-art of structural analysis of machine tool, considering the lower of process precision of surface grinder, the static and dynamic analysis were performed to components and complete of grinder, using ANSYS FEA software, improvement projects were proposed, also the optimization was carried out and has validated the feasibility of improvement projects.