1) copper titanium intermediate layer
Cu/Ti过渡层
1.
Interface structure of diamond film deposited on WC-Co substrate with copper titanium intermediate layer;
采用Cu/Ti过渡层沉积金刚石薄膜刀具的界面结构
2) Ni/Cu transitional layer
Ni/Cu过渡层
3) Cu-Ti alloyed layer
Cu-Ti合金层
4) Ti transition zone
富Ti过渡区
1.
On the other hand,when TiC and TiAl3 refine the industry aluminum together,most of the TiC particles are found within the α(Al) grains and nucleation occurs on TiC particles,and there is a Ti transition zone between TiC and aluminum interface.
结果表明:TiC单独作为工业纯铝的晶粒细化剂时,大量TiC被α(Al)晶粒推向树枝晶的晶界处,从而限制了TiC的异质形核作用;当TiC和TiAl3共同作为晶粒细化剂时,在α(Al)晶粒内部出现了大量TiC粒子,大量的TiC粒子成为了α(Al)的结晶核心,并且在TiC颗粒和铝基体的界面处存在"富Ti过渡区";TiAl3在铝熔体中分解释放出Ti原子并向TiC粒子周围偏聚,形成的"TiC/铝熔体界面富Ti过渡区"改善了TiC与α(Al)的结构适应性,降低了TiC粒子的表面张力,促进了TiC粒子在铝熔体中的均匀分布,提高了其形核能力。
5) (Ag-Cu-Ti)-SiC_p interlayer
(Ag-Cu-Ti)-SiC_P 连接层
6) Ag-Cu/Ti-substrate
Ag-Cu/Ti双层膜
1.
The adhesion strength between Ag-Cu/Ti-substrate and bilayer films which is called composite systems is tested by scratch testing method and the film stresses (residual stresses) of the thin layer of Ag-Cu alloy are determined by X-ray diffraction method in this paper.
用划痕法测试了Ag-Cu/Ti/基体双层膜体系的结合强度;用X射线衍射法测定了Ag-Cu/Ti双层膜中Ag-Cu合金薄膜的应力。
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