1) field assisted bonding
场致扩散连接
1.
The principle,application and development of field assisted bonding between metal and ceremic or glass are narrated.
阐述了陶瓷、玻璃等无机非金属材料与金属及金属基复合材料场致扩散连接的原理、应用及其发展前景。
2) field-assisted diffusion bonding
场致扩散焊接
3) diffusion bonding
扩散连接
1.
Influence of gap on diffusion stress in expansion stress diffusion bonding;
装配间隙对膨胀压差法扩散连接压力的影响
2.
Fabrication of Magnesium/aluminum Laminated Composites by Diffusion Bonding and Its Interface Properties;
镁/铝层状复合材料的扩散连接制备及界面特性
3.
Research status of brazing and diffusion bonding of ceramic and metal;
陶瓷/金属钎焊与扩散连接的研究现状
4) TLP diffusion bonding
TLP扩散连接
1.
Effects of bonding parameters on the properties of TLP diffusion bonding joints of Ti-22Al-25Nb O-phase alloy;
连接参数对Ti-22Al-25Nb合金TLP扩散连接接头性能的影响
2.
Dissymmetry of TLP diffusion bonding of dissimilar materials;
异种材料TLP扩散连接过程的非对称性
3.
The experimental study on TLP diffusion bonding of SiC particle reinforced Al based composite and aluminium alloy is conducted,and the microstructures of TLP diffusion bond is observed using SEM(S530),and the concentration profiles of elements in the joint area are measured using EDS(Link Systems 860 Analyzer).
采用TLP扩散连接方法对铝合金与SiC颗粒增强Al基复合材料进行了连接试验研究 ,应用扫描电镜和能谱分析技术对TLP连接接头进行了微观组织观察和接头区域各元素的浓度分布测试。
5) diffusion bonding(DB)
扩散连接(DB)
6) superplastic diffusion bonding
超塑性扩散连接
1.
Theoretical calculation on superplastic diffusion bonding of Ti_3Al;
Ti_3Al超塑性扩散连接的理论计算
2.
The superplastic diffusion bonding process of titanium alloy(TC4) and stainless steel(1Cr18Ni9Ti) after fine-gaining treatmented in vacuum was studied by using pure nickel as the transition metal.
采用镍箔作为中间过渡层,在真空下对TC4钛合金与1Cr18Ni9Ti不锈钢进行了微细晶超塑性扩散连接。
3.
Superplastic diffusion bonding behavior of fine-grained TC4 alloy and TC21 alloy has been investigated.
本文研究了不同晶粒度的细晶TC4合金和TC21合金在不同工艺条件下的超塑性扩散连接行为,并利用光学显微镜、扫描电子显微镜及电子探针等分析检测手段,对其超塑性扩散连接行为、接头微观组织、元素分布及断裂机制等进行了研究。
补充资料：场致发光材料(见电致发光材料)
场致发光材料(见电致发光材料)
electroluminescent material
见场致发光材料eleetrolumineseent material 电致发光材料。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条