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1)  polyamide-6
聚酰胺-6
1.
Functional polyamide-6 filaments were manufactured then.
通过双螺杆共混挤出制备了聚酰胺-6/纳米TiO2复合物,用SEM研究了复合物的微细两相结构。
2)  polyamide 6
聚酰胺6
1.
Study on high-relative viscosity polyamide 6 gel;
高相对粘度聚酰胺6冻胶的研究
2.
Effect of ultraviolet on Phanerochaete chrysosporium for decomposing caprolactam and degrading polyamide 6;
紫外线照射白腐菌对己内酰胺分解及聚酰胺6降解的影响
3.
UV Photoaging of Polyamide 6/Montmorillonite Nanocomposite;
聚酰胺6/蒙脱石纳米复合材料的紫外光老化
3)  PA6
聚酰胺6
1.
Properties of PA6 toughened with EPDM-g-MAH and study on its impact fracture surface;
EPDM接枝马来酸酐增韧聚酰胺6的性能及冲击断面形态
2.
PP/PA6 composites were prepared by melt blending process.
通过熔融共混法制备了聚丙烯/聚酰胺6(PP/PA6)复合材料。
3.
Using PA6 as the charring agent,apply the intumescent flame retardant ammonium polyphosphate(APP) in ABS resin.
以聚酰胺6(PA6)为协效成炭剂,将膨胀型阻燃剂聚磷酸铵(APP)应用于ABS树脂,通过氧指数(OI)测定及UL94测定,探讨了PA6、APP含量对阻燃体系阻燃性能的影响;同时,对复合体系进行了热失重分析,并采用扫描电镜(SEM)观察了复合物燃烧后炭层结构。
4)  Polyamide-6
聚酰胺6
1.
Preparation and Characterization of Polyamide-6/Clay Nanocomposites;
聚酰胺6/粘土纳米复合材料的制备与表征
2.
The crystallization dynamics of polyamide-6 and a sulfonated polystyrene neutralized with sodium,manganese(PA-6/NaSPS,PA-6/MnSPS) was analyzed by DSC under isothermal conditions.
用DSC测定的方法在等温条件下研究了聚酰胺6/磺化聚苯乙烯钠盐共混物(PA-6/NaSPS)和聚酰胺6/磺化聚苯乙烯锰盐共混物(PA-6/MnSPS)的结晶动力学。
3.
In this thesis, the morphology, microstructure and properties of poly(ethylene terephthalate)/polyamide-6 blend were studied.
本论文通过向聚对苯二甲酸乙二醇酯/聚酰胺6共混物中分别加入橡胶增韧剂和纳米二氧化硅,研究了该体系的增容改性。
5)  Polyamide 6
聚酰胺6(PA6)
6)  polyamide6/66
聚酰胺6/66
补充资料:(Z,Z)-9,12-十八二烯酸二聚物与二乙烯三胺的反应产物 聚酰胺树脂(低分子量,203型)
CAS:72496-94-7
分子式:(C18H32O2·C4H13N3)x
中文名称:(Z,Z)-9,12-十八二烯酸二聚物与二乙烯三胺的反应产物 聚酰胺树脂(低分子量,203型)
英文名称:9,12-Octadecadienoic acid (Z,Z)-, dimer, reaction products with diethylenetriamine; Polyamide resin, low molecular weight 203; 9,12-octadecadienoic acid (z,z)-, dimer, reaction products with diethylenetriam; 9,12-octadecadienoic acid (z,z)-, dimer, reactionproducts with diethylenetriamine; 9,12-Octadecadienoic acid(Z,Z)-,dimer,reaction products with diethylenetriamine; Polyamide resin,low molecular weight 203
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