1) damaged layer
损伤层
1.
The damaged layer introduced in surface processing on the face of GaSb wafer was observed and determined by SEM and TEM.
结果表明 :切割加工是锑化镓单晶晶片表面损伤层引入的主要工序 ;锑化镓单晶切割片表面极不平整 ,有金刚砂所引起的较粗桔皮皱纹 ;其表面损伤层深度≤ 3 0 μm ;双面研磨的锑化镓晶片表面仍有较粗桔皮皱纹 ,但比切割片的要细 ,而且桔皮皱纹的深浅随磨砂 (Al2 O3)粒径的减小而变细变浅 ;晶片的表面损伤层深度 (≤ 5 μm)也随着磨砂粒径的减小而减小。
2.
The conductive performance has been fur-ther studied in the temperature range from 193 K to 293 K by the Van der Pauw s method and themechanism of eonduetive process in the damaged layer has been discussed.
用范德堡法测量了193K至293K 温度范围内的电传导行为,对损伤层内的电传导机理进行了讨论。
3.
Laser grooving was used to fabricate the rear structure of EWT cell and the chemical etching in weak sodium hydroxide solution(NaOH) was employed to remove the vaporized silicon and the any additional damaged layer caused by laser.
采用激光刻槽的方法制备电池背面结构,用化学腐蚀的方法对槽区进行清槽和刻蚀损伤层处理。
2) Damage layer
损伤层
1.
Thickness of damage layer of LiTaO 3 wafer was determined by using double crystal rock curve method.
采用双晶摆动曲线法测量了钽酸锂晶片的加工损伤层 ,其平均值在 2 6 。
3) delamination
[英][di:,læmi'neiʃən] [美][di,læmə'neʃən]
分层损伤
1.
Nonlinear thermal buckling behavior of advanced composite grid stiffened plates with delamination;
含分层损伤的复合材料格栅(AGS)板的非线性热屈曲分析
2.
Contact effect on dynamic response of stiffened laminates with a delamination;
含分层损伤复合材料加筋板动力响应分析接触效应
3.
Investigations on Buckling and Postbuckling Behavior for Advanced Composite Grid Stiffened Structure with a Delamination;
含分层损伤先进复合材料格栅加筋结构的屈曲和后屈曲性态研究
4) delamination damage
分层损伤
1.
Buckling behavior of stiffened laminated plates with a delamination damage;
含有分层损伤的复合材料加筋层合板的屈曲性态研究
2.
Study of buckling and postbuckling behavior of stiffened laminated plates with a delamination damage;
分层损伤复合材料加筋层合板屈曲和后屈曲性态研究
3.
Thermal nonlinear buckling behavior of stiffened laminated plates with a delamination damage;
含分层损伤的复合材料加筋层合板的非线性热屈曲分析
5) thermal damage layer
热损伤层
1.
Taguchi method is employed to optimize the surface roughness,residual stress and thermal damage layer of the hardened workpiece by different combination of cutting speed,cutting depth and feed rate.
1 mm的表面残余压应力、热损伤层完全消失的表面物理性能。
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参考词条