1) conductor fabrication by laser micro-cladding electronic pastes
激光微细熔覆柔性布线
2) circuit board fabrication by laser micro cladding
激光微熔覆布线
3) laser micro-cladding
激光微细熔覆
1.
Establishment and application of temperature field model in laser micro-cladding;
激光微细熔覆温度场模型的构建与应用
2.
Structure and properties of thick-film capacitors fabricated by laser micro-cladding rapid prototype;
激光微细熔覆快速原型制造的厚膜电容组织性能
3.
Fabrication of thick film resistors by laser micro-cladding resistor pastes;
用激光微细熔覆法直写电阻浆料制备厚膜电阻
4) Laser micro-cladding
激光微熔覆
1.
A novel method to fabricate circuit board by laser micro-cladding technology was introduced in this paper.
介绍了一种利用激光制备线路板的新方法———激光微熔覆柔性布线技术 ,根据其原理和特点 ,设计并制造了相应的柔性布线系统 ,重点介绍了其软硬件组成。
5) laser flexible routing
激光柔性布线
1.
Research progresses of laser trimming, laser drilling, laser cleaning, laser flexible routing and laser micro welding applied in the IC fabrication and packaging are given.
介绍了在集成电路制造封装中采用的激光微调、激光打孔、激光清洗、激光柔性布线和激光微焊技术。
6) laser technology
激光柔性布线技术
1.
Status and prospect of conductive line fabrication by laser technology;
激光柔性布线技术的现状和展望
补充资料：熔盐电解法生产铌粉(见熔盐电解法生产钽粉)
熔盐电解法生产铌粉(见熔盐电解法生产钽粉)
production of niobium powder by molten salt electrolysis
rongyand+onjlefa ShengChan n.fen熔盐电解法生产妮粉(produetion。fn;obi-um powder by molten salt eleetrolysls)见熔盐电解法生产担粉。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条