Effect of humidity on specimen properties of structural adhesive FM300k;

Intermediate temperature setting solvent -free epoxy resin structural adhesive with high tenacity and high peeling strength modified by PU;

Epoxy resin structural adhesive with high-temperature resistant of one component at intermediate temperature;

In the paper, the present situation of high temperature curing structure adhesives and their application both at home and abroad are summaried, and their future development discussed also.

With polyurethane(PU) modification of the blend of phenol-based epoxy propane(E-51) and diglycidyl-4,5-epoxycyclohexane-1,2-dicarboxylate(TDE-85),the high performance TDE-85/E-51 epoxy resin structure adhesive was prepared with the mixed aromatic amine as curing agent.

The specification and study of national codes on the technical performance of structural adhesives;

According to the peculiarity of structural adhesives,the paper describes the development of an environment controllable automated tension testing system.

history and four developmeut stages in China and some other countries about room temperature curable epoxy resin structural adhesives (RTCERSA)were descriped.

Medium temperature curing one component inorganic/organic hybridization heat-resisted constructional adhesive;

Modification epoxy heat -resistant constructional adhesive cured at room temperature often concludes: CTBN modification epoxy resin ;ATBN or polyetheramine modification curing agent.

In this paper, using ground-based simulation facilities, the vacuum thermal cycling test was carried out on the epoxy construction adhesive.

In this paper,using ground-based simulation facilities,the vacuum thermal cycling test was carried out on the epoxy construction adhesive.

Study of GNJ type building structural adhesive;

Building Structural Adhesive and its Application and Development;