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1)  structural bonding tape
结构胶粘带
1.
Study on application performance of structural bonding tape;
结构胶粘带的应用性能研究
2)  structural adhesives
结构胶粘剂
1.
The specification and study of national codes on the technical performance of structural adhesives;
结构胶粘剂工艺性能标准的研究与制定
2.
According to the peculiarity of structural adhesives,the paper describes the development of an environment controllable automated tension testing system.
根据结构胶粘剂力学性能测试的特点,提出了一种在可控环境条件下对结构胶粘剂进行拉伸性能测试的自动化测试系统,并详细介绍了该测试系统的设计原理、硬件组成和软件实现,以及环境温度和湿度等的控制方法。
3.
history and four developmeut stages in China and some other countries about room temperature curable epoxy resin structural adhesives (RTCERSA)were descriped.
本文描述了室温固化环氧树脂结构胶粘剂的历史和四个发展阶段。
3)  structure adhesive
结构胶粘剂
1.
In the paper, the present situation of high temperature curing structure adhesives and their application both at home and abroad are summaried, and their future development discussed also.
本文介绍了国内外高温固化结构胶粘剂概况,重点介绍了国内高温结构胶粘剂的现状及展
2.
With polyurethane(PU) modification of the blend of phenol-based epoxy propane(E-51) and diglycidyl-4,5-epoxycyclohexane-1,2-dicarboxylate(TDE-85),the high performance TDE-85/E-51 epoxy resin structure adhesive was prepared with the mixed aromatic amine as curing agent.
以混合芳胺为固化剂,通过聚氨酯(PU)对4,5-环氧环己烷-1,2-二甲酸二缩水甘油酯(TDE-85)与二酚基丙烷缩水甘油醚(E-51)环氧树脂的改性,制备了一种高强高韧的耐高温环氧树脂结构胶粘剂。
4)  structural adhesive
结构胶粘剂
1.
Effect of humidity on specimen properties of structural adhesive FM300k;
湿度对结构胶粘剂FM300k测试样本性能的影响
2.
Intermediate temperature setting solvent -free epoxy resin structural adhesive with high tenacity and high peeling strength modified by PU;
中温固化高强度高剥离无溶剂聚氨酯改性环氧树脂结构胶粘剂
3.
Epoxy resin structural adhesive with high-temperature resistant of one component at intermediate temperature;
中温固化单组份耐高温环氧树脂结构胶粘剂
5)  constructional adhesive
结构胶粘剂
1.
Medium temperature curing one component inorganic/organic hybridization heat-resisted constructional adhesive;
中温固化单组分无机/有机杂化耐高温结构胶粘剂
2.
Modification epoxy heat -resistant constructional adhesive cured at room temperature often concludes: CTBN modification epoxy resin ;ATBN or polyetheramine modification curing agent.
目前室温固化耐高温环氧树脂结构胶粘剂主要采用液体端羧基丁腈橡胶增韧环氧树脂为主体,以改性液体端胺基丁腈橡胶或聚醚胺为韧性固化剂,其最高使用温度仅120℃。
6)  colloform ['kɔləfɔ:m]
胶粘结构<地>
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