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1)  Cu-1.0Ni-0.25Si-0.1Zn alloy
Cu-1.0Ni-0.25Si-0.1Zn合金
2)  Cu-TiB2 alloy
Cu-TiB2合金
3)  Cu-Zn alloy
Cu-Zn合金
1.
Nonlinear math′s model on Cu-Zn alloy bionic coupling hydrophilic surface;
Cu-Zn合金仿生耦合亲水表面非线性数学模型
2.
Hydrophobic capability of bionic Cu-Zn alloy surfaces;
Cu-Zn合金仿生耦合表面的疏水性能
3.
Analysis of valence electron structures of Cu-Zn alloy solid solutions
Cu-Zn合金固溶体的价电子结构分析
4)  Cu-Cr alloys
Cu-Cr合金
1.
Solidification behavior of induction melted Cu-Cr alloys;
感应加热熔炼Cu-Cr合金的凝固行为
2.
According to the"Empirical Electron Theory in Solid and Molecule(EET)",with the"hard sphere model",the valence electronic structures of the GP zone in Cu-Cr alloys are calculated.
应用“固体与分子经验电子理论”(EET),采用“硬球模型”,对Cu-Cr合金GP区的价电子结构进行计算。
3.
Cu-Cr alloys have been found many applications in industries because they exhibit an excellent combination of high mechanical strength of Cr with high electrical conductivities of Cu.
Cu-Cr合金因良好的结合了Cu的高导电性和Cr的高强度,在工业上具有广泛的应用,尤其是高Cr含量的Cu-Cr合金是中压真空断路器中使用最多的触头材料。
5)  Cu-Mg alloy
Cu-Mg合金
1.
The oxidation resistance of three kinds of Cu-Mg alloys after annealing were studied in 105 Pa oxygen pressure at 400~900 ℃ by SEM, EPMA, SIMS and thermogravity testing techniques.
结果表明:在H2气氛下退火后,Cu-Mg合金表面生成了MgO氧化膜,合金中Mg的含量对氧化膜的形貌及随后的高温抗氧化能力有很大影响。
6)  Cu-Sn alloy
Cu-Sn合金
1.
Rapid dendritic growth in melt-spun Cu-Sn alloys;
急冷条件下Cu-Sn合金的快速枝晶生长
2.
Microstructural morphology and phase structure of rapidly solidified Cu-Sn alloy;
快速凝固Cu-Sn合金的组织形态及相结构
3.
Preparation and improvement of Cu-Sn alloy negative electrode for lithium ion batteries;
锂离子蓄电池用Cu-Sn合金负极的制备及改性
补充资料:cu、zn-superoxide dismutase
CAS: 9054-89-1

中文名称: 过氧化物岐化酶

英文名称: Dismutase, superoxide;cu、zn-superoxide dismutase;superoxide dismutase;Dismutase,superoxide
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
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