1) Second Interface
二界面
1.
The study of a new method on Quantitative Evaluation of Second Interface Cementing Quality;
固井二界面定量评价新方法研究
2.
Bonding strength experiment of mud to cement fluid on the second interface;
MTC固井液二界面胶结强度实验研究
3.
Study on MTC enhancing the second interface bonding strength
MTC技术提高固井二界面胶结强度实验研究
2) secondary interface
第二界面
1.
Detecting cementing quality of secondary interface by using acoustic variable density logging;
利用声波变密度测井检测第二界面固井质量
2.
The acoustic variable density logging,a main method for evaluation of cementing quality,was employed for calculation of the bonding indexes of the first and the secondary interfaces by extracting the amplitude information(or energy value) of casing waves and formation waves from variable density logging,and further for evaluation of the cementing quality.
声波变密度测井作为评价固井质量的主要方法,可以提供第一和第二界面的水泥胶结质量状况。
3.
If the secondary interface fails,a pseudo-Rayleigh signal propagates in the structural compound of the casings and cement annuluses.
结果表明:第一界面发生窜槽时,会产生一个沿着钢套管传播的振铃信号;第二界面发生窜槽时,会产生沿着钢套管和水泥层复合体传播的伪瑞利波信号;2个界面同时窜槽时,能接收到一个传播速度约等于钢套管纵波速度的振铃信号,但是它的波形振动频率较低。
3) secondary interface
二级界面
1.
Effect of secondary interface microstructure on pore structure and performance of cement-based materials;
二级界面对水泥基材料孔结构和性能的影响
2.
Hydration mechanics of these three superfine powders and cement and their improvement of interfacial microstructures are researched also; therefore a con ce pt of secondary interface is developed.
介绍了粉煤灰、硅灰、纳米SiO2与水泥水化反应产物的早期界面显微结构,探讨了三种微粉与水泥水化反应的机理及对改善界面结构的作用,并提出了"二级界面"的概念。
3.
These secondary hydration products can fill in pores among different size particles and the secondary interface microstructure with compact network figure forms as a res.
这种二次水化产物可 填充不同粒径颗粒之间的孔隙,最终形成致密网络状的二级界面显微结构。
4) secondary building edge
二次界面
5) cement-formation interface
固井二界面
1.
Evaluation method for isolation ability of cement-formation interface;
固井二界面封隔能力评价方法研究
2.
The packing failure mechanism of cement-formation interface was studied,and the corresponding experimental evidences were given.
研究了固井二界面封隔失效机理,给出了相应的实验证据。
6) dineric
[dai'nerik]
二液界面的
补充资料：二步法界面缩聚工艺
分子式：
CAS号：
性质：经光气化阶段和缩聚阶段制得聚碳酸酯的合成工艺。反应温度以45℃左右为宜。此法制得的聚碳酸酯平均分子量高，热稳定性好，机械性能和电性能优良。可用以生产系列化产品。是多数工业生产装置所采用的工艺。
CAS号：
性质：经光气化阶段和缩聚阶段制得聚碳酸酯的合成工艺。反应温度以45℃左右为宜。此法制得的聚碳酸酯平均分子量高，热稳定性好，机械性能和电性能优良。可用以生产系列化产品。是多数工业生产装置所采用的工艺。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条