1) Adhesive without Primer
无底胶
1.
Study of Application of Adhesive without Primer to Extrusion Lamination;
无底胶挤出涂复的应用研究
2) primer
[英]['praɪmə(r)] [美]['praɪmɚ]
底胶
1.
Study on primer of α-cyanoacrylate adhesives for low surface energy substrate bonding;
粘接低表面能材料时α-氰基丙烯酸酯胶粘剂用底胶的研究
4) self-bonding
无胶胶合
1.
The research was based on the factors of activated chemicals' concentration,hot-pressing time and moisture content and so on,adopting the orthogonal test to study the manufacture technology of the self-bonding plywood.
以活化剂浓度、热压时间及含水率等工艺参数为因子,用正交试验法对无胶胶合板的制造工艺进行研究。
5) underfill
[英]['ʌndəfil] [美]['ʌndɚ,fɪl]
底充胶
1.
Thermal conductivity prediction of underfill and its affects on the flip chip temperature field;
底充胶导热系数预测及对倒装焊温度场的影响
2.
Influence of hygro-thermal stress on interfacial delamination of FCOB device with underfill;
湿热载荷对含底充胶的FCOB器件界面分层影响
3.
Influence of Cure-residual Stress on Underfill Epoxy Reliability in Flip-Chip Assembly Under Thermal Cycling;
固化残余应力对倒装焊底充胶可靠性的影响
6) base coating latex
底涂胶乳
1.
A new kind of latex DPL6780 made by Dow was used as base coating latex.
本文通过对DOW公司专门开发的一种新型底涂胶乳DPL6780进行上机试用,与使用原国产胶乳相比;发现不但使成纸的大部分指标性能提高,而且在同等表面强度的条件下用量进一步减少,大大降低了成本。
补充资料：无底窦
1.无底洞。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条